The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2018
Filed:
Aug. 06, 2014
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;
Masayoshi Takahashi, Tokyo, JP;
Keisuke Fukumasu, Tokyo, JP;
Yuki Fujita, Hitachinaka, JP;
Takeshi Kato, Hitachinaka, JP;
Hiroki Funato, Tokyo, JP;
Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;
Abstract
A power conversion device includes: a metal housing; a power semiconductor module that is contained in the metal housing and converts direct electric current to alternating electric current; a capacitor module that is contained in the metal housing and arranged side by side with the power semiconductor module, wherein the capacitor module smoothes the direct electric current supplied to the power semiconductor module; a substrate that has a drive circuit part mounted in a first region, the drive circuit part driving the power semiconductor module, and a control circuit part mounted in a second region, the control circuit part controlling the drive circuit part, wherein the substrate is disposed so as to cover over the metal housing; a base plate that extends in a space in which the second region of the substrate and the capacitor module oppose to each other, and that is electrically connected to the metal housing; and a first noise shielding member that extends in a direction along a boundary between the first region and the second region of the substrate, wherein the first noise shielding member separates the space from a space of the housing in which the power semiconductor module is disposed, and the first noise shielding member is electrically connected to the metal housing or a ground of the control circuit part.