The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Jun. 06, 2017
Applicant:

Fanuc Corporation, Yamanashi, JP;

Inventor:

Tetsuhisa Takazane, Yamanashi, JP;

Assignee:

FANUC CORPORATION, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01S 5/022 (2006.01); H01S 5/02 (2006.01); H01S 5/062 (2006.01); H01S 5/068 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02272 (2013.01); H01S 5/0216 (2013.01); H01S 5/068 (2013.01); H01S 5/06233 (2013.01); H01S 5/06243 (2013.01);
Abstract

A soldering system that determines soldering quality of elements relative to a housing at the moment of soldering semiconductor laser elements. A soldering device that performs soldering of a semiconductor laser element to a semiconductor laser module, a robot that conveys the module, a camera, and a control device that controls the robot and camera based on imaging output of the camera. The robot conveys the module and changes the position and posture of the camera. The camera images the module. The control device calculates the position of the semiconductor laser element based on the imaging output, calculates parallelism between the housing of the module and the semiconductor laser element based on the change in light intensity related to the imaging output when changing the relative position between the camera and the subject, and determines the quality of soldering of the semiconductor laser element based on the position and parallelism.


Find Patent Forward Citations

Takazane, Tetsuhisa. (2018). Soldering system of semiconductor laser element (U.S. Patent No. 10003170). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10003170

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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