The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Apr. 29, 2015
Applicant:

Matrix Industries, Inc., Menlo Park, CA (US);

Inventors:

Akram I. Boukai, Menlo Park, CA (US);

Douglas W. Tham, Menlo Park, CA (US);

Assignee:

MATRIX INDUSTRIES, INC., Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 35/34 (2006.01); H01L 35/32 (2006.01); H01L 21/306 (2006.01); H01L 21/3213 (2006.01); H01L 21/3063 (2006.01); H01L 21/04 (2006.01); H01L 21/302 (2006.01); H01L 21/02 (2006.01); H01L 21/3105 (2006.01);
U.S. Cl.
CPC ...
H01L 35/34 (2013.01); H01L 35/32 (2013.01); H01L 21/02019 (2013.01); H01L 21/0475 (2013.01); H01L 21/302 (2013.01); H01L 21/306 (2013.01); H01L 21/3063 (2013.01); H01L 21/30604 (2013.01); H01L 21/30608 (2013.01); H01L 21/30621 (2013.01); H01L 21/30625 (2013.01); H01L 21/31055 (2013.01); H01L 21/32133 (2013.01); H01L 21/32135 (2013.01);
Abstract

The present disclosure provides a method for forming a thermoelectric device, comprising providing a semiconductor substrate and providing a first layer of an etching material adjacent to the semiconductor substrate. The etching material facilitates the etching of the semiconductor substrate upon exposure to an oxidizing agent and a chemical etchant. Next, a second layer of a semiconductor oxide is provided adjacent to the first layer, and the second layer is patterned to form a pattern of holes or wires. The second layer and first layer are then sequentially etched to expose portions of the semiconductor substrate. Exposed portions of the semiconductor substrate are then contacted with an oxidizing agent and a chemical etchant to transfer the pattern to the semiconductor substrate.


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