The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2018
Filed:
Feb. 03, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Joo Young Oh, Asan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Abstract
A semiconductor package includes a substrate, and a first semiconductor chip stack disposed on the substrate. The first semiconductor chip stack includes a plurality of first semiconductor chips. The first semiconductor chips are stacked in a staircase configuration along a first direction. A first support is disposed on the substrate. The first support is spaced apart from the first semiconductor chip stack. A second semiconductor chip stack is disposed on the first semiconductor chip stack and the first support. The second semiconductor chip stack includes a plurality of second semiconductor chips. The second semiconductor chips are stacked in a second staircase configuration along a second direction opposite the first direction. A height of the first semiconductor chip stack is substantially equal to a height of the first support.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile