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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10002845 B1

PDFFull Text
Date of Patent:
Jun. 19, 2018

Filed:

Sep. 26, 2016

Lead-free soldering method and soldered article

Applicant:

Fuji Electric Co., Ltd., Kawasaki, JP;

Inventors:

Hirohiko Watanabe, Hachioji, JP;

Shunsuke Saito, Hachioji, JP;

Masahiro Ono, Kawasaki, JP;

Takashi Watanabe, Shiojiri, JP;

Shinji Sano, Matsumoto, JP;

Kazunaga Onishi, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki, JP;

Attorney:
Primary Examiner:

Charles Garber

Assistant Examiner:

Abdulfattah Mustapha

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/00 (2006.01); B23K 1/19 (2006.01); B23K 35/26 (2006.01); C22C 13/02 (2006.01); H01L 23/40 (2006.01); H01L 21/52 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 1/20 (2006.01); H05K 3/34 (2006.01); H01L 23/482 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 1/19 (2013.01); B23K 1/203 (2013.01); B23K 35/26 (2013.01); B23K 35/262 (2013.01); C22C 13/02 (2013.01); H01L 21/52 (2013.01); H01L 23/40 (2013.01); H01L 23/4827 (2013.01); H01L 24/05 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/81 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H05K 3/3463 (2013.01); B23K 2201/42 (2013.01); H01L 24/03 (2013.01); H01L 24/06 (2013.01); H01L 24/33 (2013.01); H01L 24/49 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05639 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/291 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32507 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/4852 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48245 (2013.01); H01L 2224/48506 (2013.01); H01L 2224/49109 (2013.01); H01L 2224/73215 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85359 (2013.01); H01L 2224/85805 (2013.01); H01L 2224/85825 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/0133 (2013.01); H01L 2924/0134 (2013.01); H01L 2924/01322 (2013.01); H05K 2201/10166 (2013.01);
Abstract

In a soldering method for Ag-containing lead-free solders to be soldered to an Ag-containing member, void generation is prevented and solder wettability is improved. The soldering method for Ag-containing lead-free solders of the present invention is a soldering method for Ag-containing lead-free solders includes a first step of bringing a lead-free solder having a composition that contains Ag that a relation between a concentration C (mass %) of Ag contained in an Sn—Ag-based lead-free solder before soldering of a mass M(g) and an elution amount B(g) of Ag contained in the Ag-containing member becomes 1.0 mass %≤(M×C+B)×100/(M+B)≤4.6 mass % and that the balance consists of Sn and unavoidable impurities into contact with the Ag-containing member, a second step of heating and melting the lead-free solder, and a third step of cooling the lead-free solder.

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