The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Apr. 19, 2016
Applicant:

Commissariat a L'energie Atomique ET Aux Energies Alternatives, Paris, FR;

Inventor:

François Marion, Saint Martin le Vinoux, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H05K 3/10 (2013.01); H01L 2224/114 (2013.01); H01L 2224/116 (2013.01); H01L 2224/1147 (2013.01); H01L 2224/1161 (2013.01); H01L 2224/11452 (2013.01); H01L 2224/11614 (2013.01); H01L 2224/11827 (2013.01); H01L 2224/11901 (2013.01); H01L 2224/13011 (2013.01); H01L 2224/1318 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/13023 (2013.01); H01L 2224/13109 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13118 (2013.01); H01L 2224/13124 (2013.01); H01L 2224/13139 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/13166 (2013.01); H01L 2224/13172 (2013.01); H01L 2224/13184 (2013.01); H01L 2224/13566 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/13624 (2013.01); H01L 2224/13687 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/81099 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81208 (2013.01); H01L 2224/81355 (2013.01); H01L 2224/81801 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01042 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01058 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01087 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A method of producing a hybridized device including two microelectronic components, including a first microelectronic component having conductive inserts on a connection surface, and a second microelectronic component having ductile conductive pads on a surface opposed to the connection surface, is provided. The method includes the steps of hybridizing the first and second electronic components face-to-face by arranging the connection surface of the first microelectronic component to oppose the surface of the second microelectronic component having the ductile conductive pads, and establishing an electro-mechanical connection between the first microelectronic component and the second microelectronic component by inserting, at ambient temperature, inserts of the first microelectronic component, provided with a second metal sub-layer, into the ductile conductive pads of the second microelectronic component.


Find Patent Forward Citations

Marion, François. (2018). Method of producing a hybridized device including microelectronic components (U.S. Patent No. 10002842). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10002842

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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