The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Mar. 22, 2016
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

William J. Anderl, Rochester, MN (US);

Bret P. Elison, Rochester, MN (US);

Phillip V. Mann, Rochester, MN (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); B23P 11/00 (2006.01); B23P 17/00 (2006.01); B23P 15/26 (2006.01); H01L 23/40 (2006.01); G06F 1/20 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/42 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4006 (2013.01); G06F 1/20 (2013.01); H01L 21/4882 (2013.01); H01L 23/3675 (2013.01); H01L 23/42 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2023/4037 (2013.01); H01L 2023/4056 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4068 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16251 (2013.01);
Abstract

A method affixes a heat sink to a module lid. A module lid is mounted to a substrate by use of a lid adhesive. The module lid has a threaded exterior portion. The module lid is thermally interfaced to a die by use of a thermal interface material. The heat sink is then screwed onto a module lid, where the heat sink includes a threaded heat sink base pocket that mates with the threaded exterior portion of the module lid, and wherein the heat sink is screwed down onto the module lid until 1) a solid mechanical and thermal contact is established between the heat sink and the module lid, and 2) an airflow from an air moving device flows unobstructed across vanes on the heat sink.


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