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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10002813 B1

PDFFull Text
Date of Patent:
Jun. 19, 2018

Filed:

Jan. 16, 2014

Adhesive composition and adhesive sheet, and hardened article and semiconductor device using same

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Akira Shimada, Otsu, JP;

Koichi Aoki, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Callie Shosho

Assistant Examiner:

John D Freeman

Int. Cl.
CPC ...
C09J 179/08 (2006.01); H01L 23/29 (2006.01); H01L 23/495 (2006.01); C09J 163/00 (2006.01); C08G 59/40 (2006.01); C09J 9/00 (2006.01); H01L 23/373 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 3/38 (2006.01);
U.S. Cl.
CPC ...
H01L 23/295 (2013.01); C08G 59/4042 (2013.01); C09J 7/28 (2018.01); C09J 9/00 (2013.01); C09J 163/00 (2013.01); C09J 179/08 (2013.01); H01L 23/293 (2013.01); H01L 23/3737 (2013.01); H01L 23/49568 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/003 (2013.01); C09J 2201/122 (2013.01); C09J 2201/602 (2013.01); C09J 2400/163 (2013.01); C09J 2479/08 (2013.01); H01L 2924/0002 (2013.01); Y10T 428/2804 (2015.01); Y10T 428/31721 (2015.04);
Abstract

The purpose of the present invention is to provide an adhesive composition having high heat conductivity and excellent adhesion, in which the dispersibility of a heat-conductive filler is controlled, and in which thermal stress during cooling/heating cycle testing can be alleviated. An adhesive composition containing a soluble polyimide (A), an epoxy resin (B), and a heat-conductive filler (C), the adhesive composition characterized by containing three types of diamine residues having a specific structure, and in that the content of the epoxy resin (B) is 30-100 parts by weight with respect to 100 parts by weight of the soluble polyimide (A).

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