The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2018
Filed:
Oct. 10, 2013
Applicant:
John Cleaon Moore, Camirillo, CA (US);
Inventor:
John Cleaon Moore, Camirillo, CA (US);
Assignee:
Other;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C11D 11/00 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01); B08B 3/04 (2006.01); C09D 5/00 (2006.01); H01L 21/027 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02304 (2013.01); B08B 3/04 (2013.01); C09D 5/008 (2013.01); C11D 11/0047 (2013.01); H01L 21/02041 (2013.01); H01L 21/0273 (2013.01); H01L 21/31133 (2013.01); H01L 21/6835 (2013.01); H01L 24/83 (2013.01); H01L 2221/6834 (2013.01);
Abstract
Compositions and methods that use rinsable primers for the removal of temporary functional coatings from substrates, for example, electronic devices, are provided. Methods are provided which discuss the use of rinsable primers to aid the removal of temporary functional coatings that include photoresist, dielectrics, adhesives, and other related materials used in temporary manufacturing applications. These compositions and methods are particularly suitable for removing temporary adhesives used in the manufacture of semiconductors and flat panel displays.