The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Oct. 12, 2016
Applicant:

Abb Schweiz Ag, Baden, CH;

Inventors:

Jan Czyzewski, Cracow, PL;

Ansgar Dais, Dietikon, CH;

Urs Kruesi, Wiesendangen, CH;

Assignee:

ABB Schweiz AG, Baden, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 17/00 (2006.01); H01B 17/28 (2006.01); B26F 1/20 (2006.01); B29C 55/08 (2006.01); H01B 19/04 (2006.01); B29C 63/00 (2006.01); H01B 19/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01B 17/28 (2013.01); B26F 1/20 (2013.01); B29C 55/08 (2013.01); B29C 63/0073 (2013.01); H01B 19/00 (2013.01); H01B 19/04 (2013.01); B29C 2793/0081 (2013.01); B29L 2031/3412 (2013.01);
Abstract

The method is provided for manufacturing a perforated sheet-like high-voltage insulating spacer for a high-voltage component, which component comprises a field grading condenser core with the spacer which is wound in spiral form around an axis, with electrically conducting layers which are inserted between successive windings of the spacer, and with a polymeric matrix which penetrates the spacer and which embeds the spacer and the layers. The method comprises at least steps as follows: an electrically insulating tape, and the patterned tape is expanded at right angle to the cutting lines in order to form a spacer with a perforated three-dimensional lattice structure. The combined effect of cutting a tape and expanding the cutted tape allows the formation of spacers with a manifold of sizes which exceed the size of the tape in function of manufacturing parameters, in particular in function of the configuration of the pattern and the magnitude of the expansion.


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