The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Feb. 25, 2014
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Muneyoshi Yamada, Yokkaichi, JP;

Akira Soga, Kita, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 19/00 (2018.01); G05B 13/02 (2006.01); G05B 19/418 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); H01L 22/20 (2013.01); G05B 2219/37224 (2013.01); H01L 22/12 (2013.01); Y02P 90/18 (2015.11); Y02P 90/20 (2015.11); Y02P 90/22 (2015.11);
Abstract

There is provided a manufacturing supporting system for an electronic device including an inspection-data acquiring unit, a fluctuation-by-classification calculating unit, a data-by-factor acquiring unit, and a fluctuation-by-factor calculating unit is provided. The inspection-data acquiring unit acquires an inspection data of a target electronic device. The fluctuation-by-classification calculating unit is configured to calculate, on the basis of the inspection data, by classification including at least any one of positions among lots, among substrates, and in a substrate plane of the electronic device, fluctuation in dimensions of the target electronic device. The data-by-factor acquiring unit acquires an improvement history data of the target electronic device. The fluctuation-by-factor calculating unit is configured to determine a plurality of fluctuation factors of the target electronic device on the basis of information concerning the plurality of fluctuation factors included in the improvement history data of the target electronic device, and calculate fluctuation in dimensions by the determined plurality of fluctuation factors. Thereby, there is provided a manufacturing supporting system, a manufacturing supporting method, and a manufacturing supporting program for an electronic device that support determination of an improvement measure for manufacturing conditions.


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