The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Dec. 01, 2016
Applicant:

Oclaro Japan, Inc., Sagamihara, Kanagawa, JP;

Inventors:

Kazuhiro Komatsu, Tokyo, JP;

Daisuke Noguchi, Kanagawa, JP;

Assignee:

OCLARO JAPAN, INC., Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01); H05K 1/02 (2006.01); H01L 31/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4279 (2013.01); G02B 6/428 (2013.01); G02B 6/4245 (2013.01); G02B 6/4246 (2013.01); G02B 6/4263 (2013.01); H05K 1/0245 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); G02B 6/4238 (2013.01); H05K 1/118 (2013.01); H05K 3/3447 (2013.01); H05K 2201/10121 (2013.01);
Abstract

A plurality of leads include a pair of differential signal leads for inputting differential signals, and a power supply lead for supplying power. A wiring pattern includes a pair of differential transmission lines connected to the pair of differential signal leads, and a power supply wiring connected to the power supply lead. A wiring board includes a first region overlapping an optical subassembly, and a second region extending from the first region so as to protrude from the optical subassembly. The pair of differential signal leads are farther away from the second region than the power supply lead. The pair of differential transmission lines are close together so as to be electromagnetically coupled to each other. The optical subassembly does not include a lead penetrating the wiring board in a region between the pair of differential transmission lines.


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