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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10001510 B1

PDFFull Text
Date of Patent:
Jun. 19, 2018

Filed:

Oct. 16, 2016

Method of manufacturing semiconductor device

Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventor:

Fukumi Unokuchi, Gunma, JP;

Assignee:

Renesas Electronics Corporation, Tokyo, JP;

Attorney:

Shapiro, Gabor and Rosenberger, PLLC

Primary Examiner:

Jermele M Hollington

Assistant Examiner:

Raul Rios Russo

Int. Cl.
CPC ...
G01R 1/067 (2006.01); G01R 31/00 (2006.01); G01R 3/00 (2006.01); H01L 21/66 (2006.01); G01R 1/073 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); G01R 1/0466 (2013.01); G01R 1/067 (2013.01); G01R 1/06716 (2013.01); G01R 1/07314 (2013.01); H01L 22/14 (2013.01); G01R 1/06722 (2013.01);
Abstract

Electrical properties of a semiconductor device are reproducibly and stably measured in a testing step of the semiconductor device. A probe pin includes a first plunger, a second plunger, a cleaning shaft, a first coil spring, and a second coil spring. The cleaning shaft accommodated in the inside of the first plunger is allowed to enter and exit through a tip of a contact of the first plunger by the second coil spring, thereby solder shavings attached to the tip of the contact are removed. The first plunger is electrically coupled to the second plunger by the first coil spring wound on an outer side face of the first plunger and on an outer side face of the second plunger.

Find Patent Forward Citations

Unokuchi, Fukumi. (2018). Method of manufacturing semiconductor device (U.S. Patent No. 10001510). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10001510

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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