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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10000674 B1

PDFFull Text
Expired
Date of Patent:
Jun. 19, 2018

Filed:

Jul. 27, 2016

Polypropylene based hot-melt adhesive composition

Applicant:

Borealis Ag, Vienna, AT;

Inventors:

Jingbo Wang, Engerwitzdorf, AT;

Carl-Gustaf Ek, Västra Frölunda, SE;

Anil Sönmez, Vienna, AT;

Klaus Bernreitner, Linz, AT;

Norbert Reichelt, Neuhofen/Krems, AT;

Assignee:

BOREALIS AG, Vienna, AT;

Attorney:

Lowenstein Sandler LLP

Primary Examiner:

Nathan M Nutter

Int. Cl.
CPC ...
C09J 123/14 (2006.01); C08F 10/06 (2006.01); C08F 10/04 (2006.01); C08K 5/00 (2006.01); C09D 191/08 (2006.01); C08L 91/06 (2006.01); C08K 3/36 (2006.01);
U.S. Cl.
CPC ...
C09J 123/14 (2013.01); C08F 10/04 (2013.01); C08F 10/06 (2013.01); C08K 3/36 (2013.01); C08K 5/005 (2013.01); C08K 5/0016 (2013.01); C08K 5/0025 (2013.01); C08K 5/0033 (2013.01); C08K 5/0066 (2013.01); C08L 91/06 (2013.01); C09D 191/08 (2013.01); C09J 2201/61 (2013.01); C09J 2203/10 (2013.01);
Abstract

The invention relates to an adhesive composition wherein such composition comprises at least one polypropylene copolymer and wherein such adhesive composition has improved overall bond performance. It further relates to an article comprising said adhesive composition, as well as to a process for producing such article. It even further relates to the use of the adhesive composition in the preparation of an article.

Find Patent Forward Citations

Wang, Jingbo. (2018). Polypropylene based hot-melt adhesive composition (U.S. Patent No. 10000674). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10000674

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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