The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2018

Filed:

Mar. 15, 2013
Applicant:

Henkel Ag & Co. Kgaa, Duesseldorf, DE;

Inventors:

Liesbeth Theunissen, Wilsele, BE;

Gunther Dreezen, Balen-Olmen, BE;

Assignee:

HENKEL AG & CO. KGAA, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 5/06 (2006.01); C09J 11/04 (2006.01); H01B 1/22 (2006.01); C08K 3/08 (2006.01); C08K 5/098 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 5/06 (2013.01); C09J 11/04 (2013.01); H01B 1/22 (2013.01); C08K 3/08 (2013.01); C08K 5/098 (2013.01); C08K 2201/001 (2013.01); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); Y10T 428/25 (2015.01);
Abstract

The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 μm to 50 μm, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.


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