The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2018
Filed:
Mar. 14, 2013
Applicant:
Henkel Ip & Holding Gmbh, Duesseldorf, DE;
Inventors:
Harry Richard Kuder, Fullerton, CA (US);
Juliet Grace Sanchez, Carson, CA (US);
Assignee:
HENKEL IP & HOLDING GMBH, Duesseldorf, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); H01B 1/22 (2006.01); H01L 23/00 (2006.01); H05K 1/09 (2006.01); H05K 3/32 (2006.01); C09D 5/24 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09D 5/24 (2013.01); H01B 1/22 (2013.01); H01L 24/29 (2013.01); H05K 1/097 (2013.01); H05K 3/321 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/8384 (2013.01); Y10T 428/256 (2015.01);
Abstract
A conductive composition that is sinterable comprises (i) micron- or submicron-sized silver flakes or powders and (ii) a fluxing agent, or an oxygenated solvent, or a peroxide. The composition can be used to adhere semiconductor dies with silver backing to copper-, silver-, or gold lead-frames at sintering temperatures of ≤250° C. without the application of pressure.