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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10000019 B1

PDFFull Text
Date of Patent:
Jun. 19, 2018

Filed:

Apr. 08, 2016

Installation assembly and associated method for forming a bonded joint

Applicant:

The Boeing Company, Chicago, IL (US);

Inventors:

Michael W. Evens, Auburn, WA (US);

Megan Nicole Watson, Kent, WA (US);

Russell L. Keller, Maple Valley, WA (US);

Nicholas H. Room, Seattle, WA (US);

John F. Spalding, Renton, WA (US);

Mary Helen Vargas, Woodinville, WA (US);

James D. Chanes, Auburn, WA (US);

Kathy Lynn Ferguson, Woodinville, WA (US);

Joseph Lawrence Hafenrichter, Seattle, WA (US);

Assignee:

The Boeing Company, Chicago, IL (US);

Attorney:

Alston & Bird LLP

Primary Examiner:

Michael N Orlando

Assistant Examiner:

Matthew Hoover

Int. Cl.
CPC ...
B29C 65/00 (2006.01); B32B 37/00 (2006.01); B29C 73/12 (2006.01); B29C 65/48 (2006.01); B29C 65/56 (2006.01); B29C 65/78 (2006.01); B32B 37/10 (2006.01); B29C 65/02 (2006.01); B29C 73/10 (2006.01); B32B 37/12 (2006.01); B32B 38/18 (2006.01); B29L 31/24 (2006.01);
U.S. Cl.
CPC ...
B29C 66/90 (2013.01); B29C 65/00 (2013.01); B29C 73/12 (2013.01); B32B 37/00 (2013.01); B29C 65/02 (2013.01); B29C 65/48 (2013.01); B29C 65/483 (2013.01); B29C 65/4835 (2013.01); B29C 65/4845 (2013.01); B29C 65/56 (2013.01); B29C 65/562 (2013.01); B29C 65/78 (2013.01); B29C 65/782 (2013.01); B29C 66/00 (2013.01); B29C 66/0012 (2013.01); B29C 66/00145 (2013.01); B29C 66/40 (2013.01); B29C 66/41 (2013.01); B29C 66/47 (2013.01); B29C 66/472 (2013.01); B29C 66/80 (2013.01); B29C 66/81 (2013.01); B29C 66/812 (2013.01); B29C 73/10 (2013.01); B29L 2031/24 (2013.01); B32B 37/0007 (2013.01); B32B 37/10 (2013.01); B32B 37/1284 (2013.01); B32B 38/1833 (2013.01);
Abstract

An installation assembly and an associated method for forming a bonded join are provided to permit the adhesive attachment of a first workpiece, such as a patch, to a portion of a second workpiece. The installation assembly and the associated method provide for at least partial debulking of the adhesive prior to curing of the adhesive such that the resulting bondline may have improved mechanical properties as a result of having fewer voids and/or porosity. The installation assembly may include an installation stand and a carrier plate supported by the installation stand and including an attachment surface configured to carry the first workpiece. The installation stand also includes an adjustment mechanism for positioning a carrier plate to a first predefined position to define a gap between the first and second workpieces and also to a second predefined position such that a predetermined bondline thickness is defined between the first and second workpieces.

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