Tung Long Lai

Title: Innovations by Tung Long Lai in Semiconductor Technology

Introduction

Tung Long Lai is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of semiconductor wafer processing.

Latest Patents

Tung Long Lai holds a patent for a "Multi-zone electrostatic chuck and chucking method." This invention involves a method for processing a semiconductor wafer that includes measuring data indicating the amount of warpage of the wafer. Based on this warpage, at least two different voltages are determined. These voltages are then applied to respective portions of the wafer by an electrostatic chuck designed to hold the wafer securely. The application of these voltages allows for effective holding of the wafer while performing fabrication processes.

Career Highlights

Tung Long Lai is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His role in this esteemed company has allowed him to contribute to advancements in semiconductor manufacturing techniques.

Collaborations

Some of his notable coworkers include Yi-Pin Chang and Soon Kang Huang. Their collaboration in the field of semiconductor technology has further enhanced the innovative capabilities of their team.

Conclusion

Tung Long Lai's contributions to semiconductor technology through his patent demonstrate his commitment to innovation in the industry. His work continues to influence the efficiency of semiconductor wafer processing.