Tama, Japan

Toshio Nakanishi


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2020-2023

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2 patents (USPTO):Explore Patents

Title: The Innovations of Toshio Nakanishi

Introduction

Toshio Nakanishi is a notable inventor based in Tama, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced film deposition methods. With a total of 2 patents to his name, Nakanishi's work is recognized for its innovative approach to creating silicon-free carbon-containing films.

Latest Patents

Nakanishi's latest patents focus on a method for depositing silicon-free carbon-containing film as a gap-fill layer by pulse plasma-assisted deposition. This method involves forming a viscous polymer in a gas phase by striking an argon, helium, or nitrogen plasma in a chamber filled with a volatile hydrocarbon precursor. The process is carefully controlled by specific parameters, including the partial pressure of the precursor during the plasma strike and the wafer temperature. This innovative technique enhances the filling capability of the films produced.

Career Highlights

Throughout his career, Toshio Nakanishi has been associated with Asm IP Holding B.V., where he has furthered his research and development efforts. His work has contributed to advancements in the semiconductor industry, particularly in the area of film deposition technologies.

Collaborations

Nakanishi has collaborated with several talented individuals in his field, including Timothee Julien, Vincent Blanquart, and Mitsuya Utsuno. These collaborations have fostered a creative environment that has led to significant advancements in their respective projects.

Conclusion

Toshio Nakanishi's contributions to the field of materials science and his innovative methods for film deposition have established him as a prominent figure in the industry. His work continues to influence advancements in technology and materials engineering.

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