Asan-si, South Korea

Sang-Jun Kim

USPTO Granted Patents = 2 

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 31(Granted Patents)


Location History:

  • Cheonan, KR (2006)
  • Asan-si, KR (2016)

Company Filing History:


Years Active: 2006-2016

Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovations of Sang-Jun Kim in Semiconductor Packaging

Introduction

Sang-Jun Kim is a prominent inventor based in Asan-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approaches. His work is primarily associated with Samsung Electronics Co., Ltd., where he has been instrumental in advancing semiconductor technologies.

Latest Patents

One of Sang-Jun Kim's latest patents is titled "Method of Fabricating Semiconductor Package." This patent outlines a method that includes providing a wafer with through silicon vias (TSVs) in the upper area and a lower area without TSVs. The process involves mounting a semiconductor chip on the upper area, forming a passivation layer, and exposing the TSVs by removing the lower area of the wafer. Additionally, it details the exposure of the top surface of the semiconductor chip by partially removing the passivation layer.

Another notable patent is "Semiconductor Package with Pattern Leads and Method for Manufacturing the Same." This invention describes a semiconductor package that utilizes insulating peripheral sealing portions and pattern leads. The package includes a substrate with a mounted semiconductor chip, surrounded by peripheral sealing layers. Conductive lead patterns connect the chip pads to corresponding substrate pads, and the design may include external connection structures such as solder balls.

Career Highlights

Sang-Jun Kim has established himself as a key figure in the semiconductor industry through his innovative work at Samsung Electronics Co., Ltd. His patents reflect a deep understanding of semiconductor packaging technologies and their applications in modern electronics.

Collaborations

Throughout his career, Sang-Jun Kim has collaborated with talented individuals such as Sung-Dae Cho and Joo-Hyung Lee. These collaborations have further enhanced the development of cutting-edge semiconductor solutions.

Conclusion

Sang-Jun Kim's contributions to semiconductor packaging through his patents demonstrate his expertise and innovative spirit. His work continues to influence the industry, paving the way for advancements in technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…