Pin-Jing Su

Title: The Innovations of Pin-Jing Su: A Pioneer in Electronic Packaging

Introduction

Pin-Jing Su, an inventive mind hailing from Taichung, Taiwan, has made significant strides in the field of electronic packaging. With one patent to his name, he has developed an innovative solution that enhances the efficiency of electronic components. His work has the potential to reshape the future of electronic manufacturing.

Latest Patents

The standout patent of Pin-Jing Su is titled "Electronic package and method of fabricating the same." This invention showcases a novel electronic package that features an encapsulating layer surrounding a series of conductive pillars and an interposer board equipped with through-silicon vias. Not only does this configuration allow for the effective electrical connection of electronic components, but it also minimizes the quantity of through-silicon vias needed. As a result, this technology reduces both fabrication time and chemical agent costs. Additionally, the design permits the substitution of larger area interposers with smaller ones, thereby enhancing the yield of produced units.

Career Highlights

Pin-Jing Su is currently associated with Siliconware Precision Industries Co., Ltd., a company renowned for its contributions to the semiconductor industry. His role in advancing electronic packaging technologies reflects the company's commitment to innovation and excellence in the field.

Collaborations

Collaboration plays a crucial role in innovation, and Pin-Jing Su has worked alongside talented individuals like Cheng-Kai Chang. Their joint efforts contribute to the development of cutting-edge technologies that propel the industry forward.

Conclusion

Pin-Jing Su’s contributions to the field of electronic packaging signify important advancements in manufacturing efficiency. With his innovative patent and collaborative spirit, he continues to be a valuable asset in the realm of electronics, shaping the future of technology with each innovation.