Monolithic 3d Inc.

Zeno Semiconductor, Inc.

Other

Easic Corporation

Or-ment LLC

William Marsh Rice University

Monlithic 3d Inc.

Monolitaic 3d Inc.

Monocithic 3d Inc

Monolthic 3d Inc.

Casic Corporation

Monolitic 3d Inc.

Or-ment L.l.c

Zvi Or-Bach

Brian Cronquist

Deepak Chandra Sekar

Yuniarto Widjaja

Jin-Woo Han

Zeev Wurman

Tal Isaac Lavian

Israel Beinglass

Jan Lodewijk De Jong

Ze'ev Wurman

Eli Lusky

Paul G Lim

Benjamin S Louie

Adrian Apostol

Richard Zeman

Adam E Levinthal

Romeo Iacobut

Laurence Hager Cooke

Dinesh Maheshwari

Petrica Avram

Isreal Beinglass

Laurance Cooke

Ilan Yehuda Granot

Dan Kikinis

James Mitchell Tour

Jun Yao

Bill Douglas Cox

J L De Jong

Adam H Leventhal

George Grigore

Albert Karl Henning

Stan Mihelcic

Alexander Sinitskiy

Alon Kapel

Ze′ev Wurman

Joseph Salzman

Elvira Beitler

George Catalin Grigore

A 3D semiconductor memory, the memory including: a first level including first memory cells, first transistors, and a first control line, where the first memory cells each include one of the first transistors; a second level including second memory cells, second transistors, and a second control line, where the second memory cells each include one of the second transistors, where the second level overlays the first level, where the second control line and the first control line have been processed following the same lithography step and accordingly are self-aligned, where the first control line is directly connected to each source or drain of at least five of the first transistors, and where the second control line is directly connected to each source or drain of at least five of the second transistors; and an oxide layer disposed between the first control line and the second control line.

3D semiconductor memory device and structure

An IC may include an array of memory cells formed in a semiconductor, including memory cells arranged in rows and columns, each memory cell may include a floating body region defining at least a portion of a surface of the memory cell, the floating body region having a first conductivity type; a buried region located within the memory cell and located adjacent to the floating body region, wherein the buried region has a second conductivity type, wherein the floating body region is bounded on a first side by a first insulating region having a first thickness and on a second side by a second insulating region having a second thickness, and a gate region above the floating body region and the second insulating region and is insulated from the floating body region by an insulating layer; and control circuitry configured to provide electrical signals to the buried region.

Semiconductor memory device having an electrically floating body transistor

A method of making a 3D multilayer semiconductor device, the method comprising: providing a first substrate comprising a first level, said first level comprising a first single crystal silicon layer; providing a second substrate comprising a second level, said second level comprising a second single crystal silicon layer; performing an epitaxial growth of a SiGe layer on top of said second single crystal silicon layer; performing an epitaxial growth of a third single crystal silicon layer on top of said SiGe layer; forming a plurality of second transistors each comprising a single crystal channel; forming a plurality of metal layers interconnecting said plurality of second transistors; and then performing a bonding of said second level onto said first level, wherein performing said bonding comprises making oxide-to-oxide bond zones, and performing removal of a majority of said second single crystal silicon layer.

Method to produce a 3D multilayer semiconductor device and structure

A floating body SRAM cell that is readily scalable for selection by a memory compiler for making memory arrays is provided. A method of selecting a floating body SRAM cell by a memory compiler for use in array design is provided.

Scalable floating body memory cell for memory compilers and method of using floating body memories with memory compilers

A method to process a 3D device, the method including: providing a first substrate including a first level including a first single crystal silicon layer and a plurality of first transistors; providing a second substrate including a second level including a second single crystal silicon layer; performing an epitaxial growth of a SiGe layer on top of the second single crystal silicon layer; performing an epitaxial growth of a third single crystal silicon layer on top of the SiGe layer; forming a plurality of third transistors including the third single crystal silicon layer; forming a plurality of metal layers interconnecting the plurality of third transistors; and then performing a hybrid bonding of the second level onto the first level.

Method to produce a multi-level semiconductor memory device and structure

A device, including: a first structure including first memory cells, the first memory cells including first transistors; and a second structure including second memory cells, the second memory cells including second transistors, where the second transistors overlay the first transistors, and a plurality of memory cells control lines, where the first transistors are self-aligned to the second transistors, where a second transistor channel of the second transistors is aligned to a first transistor channel of the first transistors, the aligned is at an atomic level as would have been resulted from an epitaxial growth process.

Semiconductor memory device and structure

A semiconductor metal-oxide-semiconductor field effect transistor (MOSFET) transistor with increased on-state current obtained through intrinsic bipolar junction transistor (BJT) of MOSFET has been described. Methods of operating the MOS transistor are provided.

MOSFET and memory cell having improved drain current through back bias application

A 3D semiconductor device, the device including: a first level including a first single crystal layer, the first level including first transistors, where each of the first transistors includes a single crystal channel; first metal layers interconnecting at least the first transistors; a second metal layer overlaying the first metal layers; and a second level including a second single crystal layer, the second level including second transistors, where the second level overlays the first level, where at least one of the second transistors includes a raised source or raised drain transistor structure, where the second level is directly bonded to the first level, and where the bonded includes direct oxide-to-oxide bonds.

3D semiconductor device and structure with single-crystal layers

A semiconductor device, the device including: a first level including a plurality of first memory arrays, where the first level includes a plurality of first transistors and a plurality of first metal layers; a second level disposed on top of the first level, where the second level includes a plurality of second memory arrays; a third level disposed on top of the second level, where the third level includes a plurality of third transistors and a plurality of third metal layers, where the third level is bonded to the second level, where the bonded includes oxide to oxide bonding regions and a plurality of metal to metal bonding regions, where the first level includes first filled holes, where the second level includes second filled holes, and where the third level includes a plurality of decoder circuits.

3D memory devices and structures with control circuits

A 3D semiconductor device including: a first level including a first single crystal layer and first transistors, and at least one first metal layer-which includes interconnects between the first transistors forming control circuits-which overlays the first single crystal layer; a second metal layer overlaying first metal layer; a second level including second transistors, first memory cells (each including at least one second transistor) and overlaying second metal layer; a third level including third transistors (at least one includes a polysilicon channel), second memory cells (each including at least one third transistor and cell is partially disposed atop control circuits) and overlaying the second level; control circuits control data written to second memory cells; third metal layer disposed above third level; fourth metal layer includes a global power distribution grid, has a thickness at least twice the second metal layer, and is disposed above third metal layer.

3D semiconductor device and structure with metal layers and memory cells

An electrical passenger car, the electrical passenger car including: at least two electrically driven motors; motor control electronics, where the motor control electronics are connected to the at least two electrically driven motors; wheels, where the wheels are connected to the at least two electrically driven motors; and sensors, where the sensors are connected to at least the motor control electronics, where the wheels include a first wheel and a second wheel, where the second wheel has a radius at least 7% greater than a radius of the first wheel, where the motor control electronics control the at least two electrically driven motors to provide a greater torque to the first wheel than to the second wheel, and where the electrical passenger car is designed to operate efficiently on a paved road.

Efficient electrical passenger car with motor control

An integrated device, the device including: a first level including a first mono-crystal layer, the first mono-crystal layer including a plurality of single crystal transistors; an overlying oxide disposed on top of the first level; a second level including a second mono-crystal layer, the second level overlaying the oxide, where the second mono-crystal layer includes a plurality of image sensors, where the second level is bonded to the first level, where the bonded includes an oxide to oxide bond; and a plurality of pixel control circuits, where each of the plurality of image sensors is directly connected to at least one of the plurality of pixel control circuits, and where the integrated device includes a plurality of memory circuits.

Multilevel semiconductor device and structure with image sensors and wafer bonding

A method for producing a 3D semiconductor device including: providing a first level including a first single crystal layer; forming a first metal layer on top of first level; forming a second metal layer on top of the first metal layer; forming at least one second level above the second metal layer; performing a first lithography step on the second level; forming a third level on top of the second level; performing a second lithography step on the third level; perform processing steps to form first memory cells within the second level and second memory cells within the third level, where first memory cells include at least one second transistor, and the second memory cells include at least one third transistor; and deposit a gate electrode for the second and the third transistors simultaneously.

Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers

A 3D memory device including: a plurality of memory cells, where each memory cell of the plurality of memory cells includes at least one memory transistor, where each of the at least one memory transistor includes a source, a drain, and a channel; and a plurality of bit-line pillars, where each bit-line pillar of the plurality of bit-line pillars is directly connected to a plurality of the source or the drain, where the plurality of bit-line pillars are vertically oriented, where the channel is horizontally oriented, where each of the at least one memory transistor is directly connected to at least one of the plurality of bit-line pillars, where the plurality of memory cells include a partially or fully metalized source structure and/or a partially or fully metalized drain structure, where the metalized source includes two metal structures, and where the two metal structures include a tungsten structure.

3D memory semiconductor devices and structures with bit-line pillars

A method for producing 3D semiconductor devices including: providing a first level including first transistors and a first single crystal layer; forming a first metal layer on top of the first level; forming a second metal layer on top of the first metal layer; forming at least one second level on top of or above the second metal layer; performing a lithography step on the second level; forming at least one third level on top of or above the second level; performing processing steps to form first memory cells within the second level and second memory cells within the third level, where the first memory cells include at least one second transistor, the second memory cells include at least one third transistor, first transistors control power delivery to some second transistors; and then forming at least four independent memory arrays which include some first memory cells and/or second memory cells.

Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers

Growing community of inventors

San Jose, CA, United States of America

Zvi Or-Bach