Orbotech Limited

The State of Israel, Atomic Energy Commission, Soreq Nuclear Research Center

The State of Israel, Atomic Energy Commission, Soreq Nuclear Research

Orbtech Ltd.

State of Isreal, Atomic Energy Commision, Soraq Nuclear Research Center

Zvi Kotler

Michael Zenou

Eliezer Lipman

Abraham Gross

Bruno Sfez

Itay Peled

Dan Alon

Aner Lev

Marc Altman

Ofer Fogel

Ronald F Kaminsky

Oleg Ermak

Boris Greenberg

Claudio Rottman

Golan Hanina

Yehiam Prior

Benny Naveh

Hanina Golan

Abraham Rotnemer

Erel Granot

Yuval Berg

Sharona Cohen

Gil Bernstein Toker

Jonathan Ankri

Peter Grobgeld

Michael Zanou

Bruno Gad Sfez

Optical apparatus () includes a laser (), which is configured to emit a beam of coherent optical radiation at a specified wavelength along a beam axis. A deflector () is configured to intercept and selectably deflect the beam over a range of angles relative to the beam axis. A plurality of diffractive optical elements (DOEs—) are positioned to receive the deflected beam at different, respective deflection angles within the range and to output respective diffracted beams. Beam-combining optics () are configured to receive and deflect the diffracted beams from the DOEs so that all of the diffracted beams are directed along a common output axis toward a target ().

High-speed dynamic beam shaping

Printing apparatus includes a donor supply assembly, which positions a transparent donor substrate having opposing first and second surfaces and a donor film formed on the second surface so that the donor film is in proximity to a target area on an acceptor substrate. An optical assembly directs one or more beams of laser radiation to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection of material from the donor film onto the acceptor substrate. Means are provided to mitigate or compensate for the variation in reflection of the laser radiation across an area of the donor substrate, so as to equalize a flux of the laser radiation that is absorbed in the donor film across the area of the donor substrate.

Lift printing using thin donor foils

A method for manufacturing includes applying patterned electromagnetic energy to each of a sequence of layers of a dry film comprising a photosensitive material so as to create in the photosensitive material in each of the layers a respective two-dimensional (2D) pattern corresponding to a slice of a predefined three-dimensional (3D) structure. The layers in the sequence in which the respective 2D pattern has been created are laminated together to produce a multi-layer stack. The multi-layer stack is developed so as to remove the photosensitive material in which the 2D pattern has not been created, thereby forming the 3D structure.

Hybrid, multi-material 3D printing

A method for producing electronic devices includes fixing a die that includes an electronic component with integral contacts to a dielectric substrate. After fixing the die, a conductive trace is printed over both the dielectric substrate and at least one of the integral contacts, so as to create an ohmic connection between the conductive trace on the substrate and the electronic component.

Electrical interconnection of circuit elements on a substrate without prior patterning

A method for circuit fabrication includes defining a solder bump, including a specified solder material and having a specified bump volume, to be formed at a target location on an acceptor substrate. A transparent donor substrate, having a donor film including the specified solder material, is positioned such that the donor film is in proximity to the target location on the acceptor substrate. A sequence of pulses of laser radiation is directed to pass through the first surface of the donor substrate and impinge on the donor film so as to induce ejection from the donor film onto the target location on the acceptor substrate of a number of molten droplets of the solder material such that the droplets deposited at the target location cumulatively reach the specified bump volume. The target location is heated so the deposited droplets melt and reflow to form the solder bump.

High-resolution soldering

A method of producing a conductive path on a substrate including depositing on the substrate a layer of material having a thickness in the range of 0.1 to 5 microns, including metal particles having a diameter in the range of 10 to 100 nanometers, employing a patterning laser beam to selectably sinter regions of the layer of material, thereby causing the metal particles to together define a conductor at sintered regions and employing an ablating laser beam, below a threshold at which the sintered regions would be ablated, to ablate portions of the layer of material other than at the sintered regions.

System producing a conductive path on a substrate

Optical apparatus includes an acousto-optic medium and an array of multiple piezoelectric transducers attached to the acousto-optic medium. A drive circuit is coupled to apply to the piezoelectric transducers respective drive signals including at least first and second frequency components at different, respective first and second frequencies and with different, respective phase offsets for the first and second frequency components at each of the multiple piezoelectric transducers.

Acousto-optic deflector with multiple output beams

A method for metallization includes providing a transparent donor substrate () having deposited thereon a donor film () including a metal with a thickness less than 2 &#x3bc;m. The donor substrate is positioned in proximity to an acceptor substrate () including a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate. A train of laser pulses, having a pulse duration less than 2 ns, is directed to impinge on the donor substrate so as to cause droplets () of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace () in ohmic contact with the semiconductor material.

LIFT printing of conductive traces onto a semiconductor substrate

A method for fabrication includes providing a substrate having an upper surface with pattern of one or more recesses formed therein. A laser beam is directed to impinge on a donor film so as to eject droplets of a fluid from the donor film by laser-induced forward transfer (LIFT) into the one or more recesses. The fluid hardens within the one or more recesses to form a solid piece having a shape defined by the one or more recesses. The substrate is removed from the solid piece. In some embodiments, the recesses are coated with a thin-film layer before ejecting the droplets into the recesses, such that the thin-film layer remains as an outer surface of the solid piece after removing the substrate.

Control of surface properties of printed three-dimensional structures

A method for 3D printing includes printing a first metallic material on a substrate as a support structure (). A second metallic material, which is less anodic than the first metallic material, is printed on the substrate as a target structure (), in contact with the support structure. The support structure is chemically removed from the target structure by applying a galvanic effect to selectively corrode the first metallic material.

Printing of three-dimensional metal structures with a sacrificial support

A method for material deposition includes providing a transparent donor substrate () having opposing first and second surfaces and multiple donor films () including different, respective materials on the second surface. The donor substrate is positioned in proximity to an acceptor substrate (), with the second surface facing toward the acceptor substrate. Pulses of laser radiation are directed to pass through the first surface of the donor substrate and impinge on the donor films so as to induce ejection of molten droplets containing a bulk mixture of the different materials from the donor films onto the acceptor substrate.

Lift printing of multi-composition material structures

A method for manufacturing includes coating a substrate () with a matrix () containing a material to be patterned on the substrate. A pattern is fixed in the matrix by directing a pulsed energy beam to impinge on a locus of the pattern so as to cause adhesion of the material to the substrate along the pattern without fully sintering the material in the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

Pulsed-mode direct-write laser metallization

Method producing a conductive path on a substrate

An apparatus for material deposition on an acceptor surface includes a transparent donor substrate having opposing first and second surfaces, and a donor film on the second surface. The apparatus additionally includes an optical assembly, which is configured to direct a beam of radiation to pass through the first surface of the donor substrate and impinge on the donor film at a location on the second surface so as to induce ejection of droplets of molten material from the donor film at an angle that is not normal to the second surface at the location onto the acceptor surface.

Growing community of inventors

Tel Aviv, Israel

Zvi Kotler