Lilogix, Inc.

Other

Rd Automation

Zvi Bendat

Miroslaw Sokol

Lionel Powell

Felix Zeigerman

Henry Chou

The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.

Process and apparatus for mounting semiconductor components to substrates and parts therefor

An optical probe for use in accurately aligning the surfaces of microelectronic components that are to be joined together includes an optical device adapted to superimpose the images of a pair of components positioned on either side of the device. The optical device comprises an optical beam-splitter and plurality of prisms having mirror surfaces arranged so that the superposition of images takes place at the partially reflective interface within the beam-splitter. The resulting superimposed image of the die and substrate is displaced laterally from the microelectronic components so that the image is not projected onto either component.

Optical system for aligning a pair of objects

The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.

Precision bond head for mounting semiconductor chips

Mounting apparatus for electronic parts includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.

Mounting apparatus for electronic parts

Mounting apparatus for electronic parts is disclosed. More particularly, the mounting apparatus includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.

Growing community of inventors

New York, NY, United States of America

Zvi Bendat