Google Inc.

Avago Technologies Fiber IP (singapore) Pte. Ltd

Zuowei Shen

Melanie Beauchemin

Ryohei Urata

Hong Liu

Federico Pio Centola

Madhusudan K Iyengar

William Frank Edwards

Michael Chi Kin Lau

Timothy Conrad Lee

Justin Sishung Lee

Kyle Fukuchi

Ilyas Mohammed

Laurence Ray McColloch

Jamyuen Ko

Michael Allen Robinson

Shawn Emory Bender

Gregory Sizikov

Gurushankar Rajamani

Peter Pei-Tak Ho

William F Edwards

Chee Yee Chung

Nathan Folkner

Horia Alexandru Toma

Biao He

Xu Gao

Mark Villegas

The disclosure provides for high bandwidth processing through the sharing of memory dies over a plurality of computing dies via an optical interchange. The optical interchange may be configured so as to operate as both an optical switch and optical demultiplexer. The optical switch configuration for the optical interchange allows for data to be written from any computing die to one of a plurality of memory dies via an optical connection. The optical demultiplexer configuration allows for data to be broadcast from a memory die to a plurality of the computing dies.

Systems for high-speed computing using an optical interchange

The technology generally relates to determining a status of an optical channel between two components. For example, the components may be connected via an optical link including a plurality of optical channels. A first portion of the optical channels may be in use such that a second portion of the optical channels may be redundant channels. The component may include a test generator that transmits and receives a data pattern over each channel. The test generator may determine, based on the received data pattern, a status of each of the channels. If the status of a given channel is a failure status, the component may divert data for the given channel to a redundant channel.

Reduce link repair rate with added redundancy in parallel optical links

Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Thermal optimizations for OSFP optical transceiver modules

An electromagnetic interference ('EMI') sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.

Electromagnetic interference ('EMI') sheet attenuators

The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

Heat dissipation approach in chip on board assembly by using stacked copper Microvias

Heat dissipation approach in chip on board assembly by using stacked copper microvias

The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver that are spatially separated. In some implementations, the optical receiver and optical transmitter are staggered from one another. Each of the optical receiver and the optical transmitter and housed within a separate optical lens. In some implementations, the separation of the components reduces mechanical, thermal, and electrical cross talk between the optical transmitter and the optical receiver. The separation of the components can also ease the constraints of the optical alignment between the optical transmitter and the optical receiver and each of their respective lenses.

Optical transceiver having separate transmitter and receiver lenses

Systems and methods for achieving eye safety of an optical transceiver are provided. An optical module can be configured to output a first optical signal. A first photodetector can be configured to output a signal indicative of a presence or absence of a second optical signal. A controller can be coupled to the optical module and the first photodetector and can be configured to control the output of the optical module. In response to a determination that an output of the first photodetector indicates the second optical signal is absent, the controller can control the optical module to output the first signal at a decreased average optical power. In response to a determination that an output of the first photodetector indicates the second optical signal is present, the controller can control the optical module to output the first signal at an increased average optical power.

Systems and methods for achieving improved eye safety of an optical transceiver

An optical attenuation system that includes first and second attenuators providing different attenuations of corresponding received optical signals. The first attenuator receives an optical signal emitted by a transmitter of a first transceiver and delivers the received optical signal to a receiver of a second transceiver. The second attenuator receives an optical signal emitted by a transmitter of the second transceiver and delivers the received optical signal to a receiver of the first transceiver. A method may include determining first and second optical attenuations for the first and second attenuators, respectively, and for at least one attenuator, arranging a first fiber optic cable having a first core size in series with a second fiber optic cable having a second core size to provide the determined corresponding optical attenuation.

Optical attenuation system

A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or 'float', as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.

Optical transceiver module having an electromagnetic interference (EMI) cancellation device disposed therein, and an EMI cancelation method for use in an optical transceiver module

Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.

Growing community of inventors

Los Altos, CA, United States of America

Zuowei Shen