Seagate Technology Incorporated

Snap Inc.

Zubair Ahmed Khan

Joel William Hoehn

Andrew D Habermas

Dat Quach

Benjamin Ralph Hollis

Bradley Baron

David Andrew Killian

Peter John Gunderson

James Daniel Baird

Sarah R Marotz

Amit Saurav

Willis J Johnson

Spoorthi Ravi

Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Adhesive for processing a microelectronic substrate, and related methods

The present disclosure relates to methods of forming adhesive films having at least one pressure-sensitive adhesive polymer, related films, and related methods of using such films in lapping processes.

Methods of forming an adhesive layer, and related adhesive films and methods and systems of using adhesive films

Systems and methods are provided for synchronizing data. The systems and methods include operations for: storing a synchronization entry for a messaging application feature, the synchronization entry comprising a last update timestamp associated with a first update to content of the messaging application feature received from a first source; receiving a second update to the content of the messaging application feature from the first source; determining that the second update was received within a write window of the last update timestamp; in response to determining that the second update was received within the write window of the last update timestamp, preventing updating the last update timestamp; and sending the first update and the second update to a client device in response to receiving a synchronization request from the client device based on the last update timestamp.

Windowed writes

Particles are removed from electronic components, such as components of data storage devices by use of an electrochemical process. An electronic component is immersed in an electrochemical bath, and a voltage is applied across the +ve electrode and &#x2212;ve electrode in an amount sufficient to remove charged particles present on a surface of the electronic component.

Method of removing particles from an electronic component

Disclosed herein are embodiments of a method of making a lubricant composition for lapping a ceramic material. The method includes mixing a base lubricant component and a powdered wax composition component to form the lubricant composition. The powdered wax composition component includes a powdered wax dispersion or a powdered wax emulsion. The amount of powdered wax composition component mixed with the base lubricant component is from 0.01 to 10 percent by weight of the lubricant composition. Also disclosed herein are embodiments of related lubricant compositions and/or methods of using the lubricant to lap a ceramic substrate (e.g., one or more bars of sliders).

Lubricant composition for lapping ceramic material, and related methods

Growing community of inventors

Villa Park, IL, United States of America

Zubair Ahmed Khan