Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Hong Heng Sheng Electronical Technology (huaian) Co., Ltd.

Zu-Ai Li

Mei-Hua Huang

Ning Hou

Si-Hong He

Biao Li

Qiang Song

Jin-Cheng Wu

Cheng-yi Yang

Yao-Cai Li

Yan-qiong He

An anti-shake assembly with reduced size is disclosed which includes a circuit board, a photosensitive chip, and a magnetic component. The circuit board includes a first rigid board, a second rigid board, a plurality of connectors, and a plurality of coils. The first rigid board has a housing space. The second rigid board is movably housed in the housing space. The connectors are flexibly connected between the first rigid board and the second rigid board. The photosensitive chip and the coils are provided on the second rigid board. The magnetic component includes a base and a plurality of magnets. The base includes a central plate and a side plate. The side plate is arranged around a periphery of the central plate to form a housing space. The magnets are provided on the central plate facing the housing space. The magnets are arranged opposite to the coils.

Anti-shake assembly and manufacturing method therefor, camera module with the anti-shake assembly

The present invention relates to a multi-sided light-emitting circuit board, which includes: a transparent substrate layer and a first conductive circuit layer on at least one surface of the transparent substrate layer. The first conductive circuit layer includes conductive portions arranged at intervals. A metal piece is formed on a surface of each conductive portion away from the transparent substrate layer. An accommodation space is formed between adjacent metal pieces. The accommodation space is provided with a light-emitting chip. Each light-emitting chip includes two electrodes. The two electrodes are respectively located at opposite ends of the light-emitting chip. The electrodes are respectively electrically connected to adjacent metal pieces. An encapsulant layer is formed on a surface of the first conductive circuit layer. The encapsulant layer covers and encapsulates the metal pieces and the light-emitting chips. The invention also relates to a method for manufacturing a multi-faceted light-emitting circuit board.

Multi-sided light-emitting circuit board and manufacturing method thereof

A circuit board () includes an insulating base layer (), a first conductive circuit layer () disposed on the base layer (); a solder mask layer () covering the first conductive circuit layer () away from the base layer (), wherein the solder mask layer () defines a slot (), the slot () exposes a portion of the first conductive circuit layer (), the solder mask layer () includes a sidewall () at the slot (); and a cover film () covering the solder mask layer (), wherein the cover film () defines an opening (), the opening () corresponds to the slot () and exposes the solder pad (), the cover film () includes a covering portion () and a side reflecting portion (), the covering portion () is disposed on the solder mask layer (), the side reflecting portion () is connected to the covering portion () and covers the sidewall ().

Circuit board, method for manufacturing the same, and backlight

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Shenzhen, China

Zu-Ai Li