Gm Cruise Holdings LLC

Nvidia Corporation

Other

Zoran Stefanoski

Robert Y Cao

Yung Chang Ko

Jeong Hun Kim

Srinivasa Rao Damaraju

Joseph Douglass Walters

Tommy Lee

Brian Schlotterbeck

Reza Azizian

Kaida Chen

Roger Lo

Wen-chieh Tang

Gilberto Madrid Gomez

Jameson Tai

Cathy Yoon

Examples of the present disclosure provide an apparatus for hybrid heat spreading and heating, comprising: a heating element and a heat exchanger proximate to the heating element, wherein the apparatus is configured to be thermally coupled to an IC device that is configured to operate above a minimum operating temperature. The heating element is configured to: power on when the ambient temperature is below the minimum operating temperature and the IC device is not powered on and power off after the IC device is powered on. The heat exchanger is configured to conduct heat from the heating element to the IC device when the heater is powered on, such that the IC device is heated to a temperature above the minimum operating temperature and conduct heat away from the IC device when the IC device is powered on.

Hybrid heat spreading and heating of a computing system in an autonomous vehicle

Various technologies described herein pertain to a sensor for an autonomous vehicle that includes one or more heat dissipation features. A sensor includes a top cover and a bottom cover, where the top cover and the bottom cover form at least a portion of a casing of the sensor. The sensor includes a coldplate, a first printed circuit board, and a second printed circuit board. A top side of the first printed circuit board is coupled to the top cover and a bottom side of the first printed circuit board is coupled to a top side of the coldplate. A top side of the second printed circuit board is coupled to a bottom side of the coldplate and a bottom side of the second printed circuit board is coupled to the bottom cover. Various features described herein enhance heat transfer from components on the first and second printed circuit boards.

Heat dissipation features of autonomous vehicle sensor

An example automated driving system computer can include a board, one or more processors coupled to the board, a first layer of a first thermal interface material applied on the one or more processors, a heat spreader having a first side and a second side, the first side in contact with the first layer of the first thermal interface material, a second layer of a second thermal interface material applied on the second side of the heat spreader, and a cold plate in contact with the second layer of the second thermal interface material.

Floating heat spreader for processing assembly

Various technologies described herein pertain to a heat spreader for an autonomous vehicle computing device. The heat spreader includes a top surface, a bottom surface, and a side surface. The top surface of the heat spreader is thermally conductive. The top surface of the heat spreader includes a section that is sized and shaped to align with a heat generating component (e.g., on a printed circuit board assembly). The top surface of the heat spreader is configured to receive heat from the heat generating component. The bottom surface of the heat spreader includes externally integrated fins. The heat spreader is configured to dissipate the heat from the heat generating component such that the heat from the heat generating component flows from the top surface to the externally integrated fins on the bottom surface.

Heat spreader with integrated fins

Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.

Autonomous vehicle computing device with barrier layer

Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes.

Embedded and immersed heat pipes in automated driving system computers

An example sensor bracket assembly can include one or more cold plates forming a core bracket structure, wherein the core bracket structure and the one or more cold plates provide structural support for the sensor bracket assembly; a housing enclosing the core bracket structure; one or more sensor mounts for mounting one or more sensors on the sensor bracket assembly; and one or more attachment portions for attaching the sensor bracket assembly to a body of a vehicle.

Structural mount with integrated cooling for autonomous vehicle sensors

Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers.

Embedded and immersed vapor chambers in automated driving system computers

Two-phase cooling systems for autonomous driving super computers (ADSC) are described herein. In some examples, a two-phase cooling system can include a flow channel configured to circulate a flow; an evaporative heat exchanger comprising an inlet for receiving fluid from the flow channel and an outlet for releasing vapor generated from the fluid, the evaporative heat exchanger being configured to collect heat from components of the ADSC and transfer the heat away via the vapor released from the first outlet; a condensing heat exchanger configured to condense the vapor and remove latent heat associated with the vapor, the condensing heat exchanger comprising an inlet to the flow channel for receiving the vapor and an outlet to the flow channel for discharging fluid generated by condensing the vapor; and a pump configured to receive the fluid from the condensing heat exchanger and circulate the fluid to the evaporative heat exchanger.

Two-phase cooling systems for autonomous driving super computers

One embodiment of a system for cooling a heat-generating device includes a base adapted to be coupled to the heat-generating device, a housing coupled to the base, a liquid channel formed between the base and the housing, where a heat transfer liquid may be circulated through the liquid channel to remove heat generated by the heat-generated device, and a heat pipe disposed within the liquid channel, where the heat pipe increases the heat transfer surface area to which the heat transfer liquid is exposed. Among other things, the heat pipe advantageously increases the heat transfer surface area to which the heat transfer liquid is exposed and efficiently spreads the heat generated by the heat-generating device over that heat transfer surface area. The result is enhanced heat transfer through the liquid channel relative to prior art cooling systems.

Embedded heat pipe in a hybrid cooling system

The present invention represents a significant advancement in the field of cooling systems for computer hardware. One embodiment of a system for cooling a heat-generating device includes a housing sized to fit within a drive bay of a computing device, a heat exchanger disposed within the housing and configured to transfer heat from liquid to air, a fan disposed within the housing and configured to force air through the heat exchanger, and a pump disposed within the housing and configured to circulate a liquid through a cold plate sub-assembly and back to the heat exchanger. The cold plate sub-assembly is configured to be thermally coupled to the heat-generating device. The disclosed system may be advantageously disposed in any computing device whose chassis has a standard-sized drive bay, thereby enabling the system to be easily implemented across a wide variety of computing devices.

Drive bay heat exchanger

One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

System for efficiently cooling a processor

Embodiments for providing cooling for computing platform components are disclosed. In one example embodiment, a coolant may be provided from connector extending through a bracket to heat dissipation device thermally coupled to a processor mounted on a printed circuit board, wherein the printed circuit board and the bracket comprise a daughter card to be inserted into a connector on a motherboard of the computing platform.

Growing community of inventors

San Francisco, CA, United States of America

Zoran Stefanoski