Memsic, Inc.

Zongya Li

Yang Zhao

Yaping Hua

Yongyao Cai

Haidong Liu

Jerome S Marcelino

Matthieu Lagouge

Feiming Huang

Mark Laich

Hanwu Xiao

Hongyuan Yang

Yanwei Chen

A magnetometer with only a SET operation for initiating a magnetic orientation within a magnetic field sensor based on anisotropic magnetoresistive (AMR) technology. Within the magnetometer, the relative orientations of the respective X, Y and Z axes detectors are maintained by a package in which all detectors are mounted on a single assembly with the Z axis sensor displaced and held orthogonal to the other two sensors by potting material. Shorting bars on respective barber pole structures are provided with a geometry that allows for closer placement of adjacent barber poles to one another. The barber pole structures are deposited in a nested orientation which provides for balanced resistance legs in a Wheatstone bridge construction.

Magnetometer

A method and device for identifying leaks in or a leakage rate of an integrated circuit package. The method and device include integrating a micromachined-thermal-convection accelerometer in the integrated circuit package and evaluating the initial and subsequent sensitivities of the accelerometer. A change in sensitivity with time provides indicia of a leak and a measure of leakage rate.

Leakage detection method using micromachined-thermal-convection accelerometer

Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other integrated circuit to a substrate; applying and curing a relatively-soft, protective material over the sensing portion of the sensing device; positioning a covering tool over the cured material; applying and curing a relatively-hard, protective coating around the covering tool and the relatively-soft, protective material; and applying a second, relatively-soft, protective material in the void left by the withdrawn covering tool.

Sensor packaging method for a human contact interface

Devices for providing tri-axial measurements in an x-direction, a y-direction, and a z-direction and methods of their manufacture are disclosed. The devices comprise a leadframe, at least one X- and Y-axis sensor die, at least one integrated circuit, and a Z-axis sensor. The Z-axis sensor is encapsulated in a pre-molding before the leadframe, X- and Y-axis sensor die(s), integrated circuit(s), and the pre-molding are encapsulated to provide a final molding.

Three-dimensional multi-chips and tri-axial sensors and methods of manufacturing the same

A wafer-level packaged IC is made by attaching a cap wafer to the front of an IC base wafer before cutting the IC base wafer, i.e. before singulating the plurality of dies on the IC base wafer. The cap wafer is mechanically attached and electrically connected to the IC base wafer, then the dies are singulated. Electrically conductive paths extend through the cap wafer, between wafer contact pads on the front surface of the cap and electrical contact points on the IC base wafer. Optionally, the cap wafer contains one or more dies. The IC base wafer can be fabricated according to a different technology than the cap wafer, thereby forming a hybrid wafer-level package. Optionally, additional 'upper-level' cap wafers (with or without dies) can be stacked to form a 'multi-story' IC. Optionally, a hermetically-sealed cavity headroom is provided.

Growing community of inventors

Jiangsu, China

Zongya Li