Goertek Inc.

Weifang Goertek Microelectronics Co., Ltd.

Zonglin Zhou

Mengjin Cai

Junkai Zhan

Guanxun Qiu

Qinglin Song

The present invention discloses a piezoelectric microphone. The piezoelectric microphone comprises a substrate having a cavity-backed, and a piezoelectric film connected to the upper side of the substrate via an insulating layer. A position on the piezoelectric film, which is located at the inner side of a junction of the piezoelectric film and the substrate, is provided with a plurality of hollowed-out holes. The hollowed-out holes in the piezoelectric film are at least partly overlapped with the substrate. A gap is provided between the substrate and the position, where the hollowed-out holes are located, on the piezoelectric film. The gap and the hollowed-out holes a together form a channel. Compared with the traditional hollowed-out structure, the gap of the present invention can hinder the sound from directly spreading via the hollowed-out holes, thereby greatly reducing the amount of leakage of low-and-intermediate frequency signals of the piezoelectric microphone and improving the performance of the piezoelectric microphone. In addition, the gap can also effectively prevent a chip from being damaged by the invasion of dust, particles and water.

Piezoelectric microphone

An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm () and back-pole () which forms a condenser structure are formed on a substrate () having at least one recessed slot () on the top. A sensitive electrode is formed on the substrate (), the sensitive electrode comprising a fixed portion () fixed on the substrate () via a sacrificial layer (), and a bending portion () inserted into the recessed slot (), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm () and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate () at the same time, from the same material, and using the same fabricating process to increase production efficiency.

Acoustic sensor integrated MEMS microphone structure and fabrication method thereof

An MEMS microphone is disclosed, which comprises a substrate and a vibrating diaphragm and a back electrode which are located above the substrate, a plurality of comb tooth parts are formed in edge positions of the vibrating diaphragm, and the plurality of comb tooth parts are distributed in a peripheral direction of the vibrating diaphragm at intervals, wherein a position between every two adjacent comb tooth parts on the vibrating diaphragm is connected to the substrate via an insulating layer; and the comb tooth parts on the vibrating diaphragm are at least partially overlapped with the substrate, and a clearance exists between the comb tooth parts and the substrate and is configured as an airflow circulation channel. The microphone of the present invention has better impact resistance and can avoid intrusion of dust.

MEMS microphone

A method for forming a filter net on an MEMS sensor and an MEMS sensor are disclosed. The method comprises the following steps: disposing a dissociable adhesive tape on a base material, and forming a filter net on an adhesive surface of the dissociable adhesive tape; transferring the filter net on a film to form a self-adhesive coiled material; and transferring and adhering the filter net on the self-adhesive coiled material to collecting a hole of the MEMS sensor. The filter net formed by the method have fine and uniform meshes, and a yield is high. In addition, the method is suitable for large-scale and industrialized production.

Growing community of inventors

Shandong, China

Zonglin Zhou