Lenovo (beijing) Limited

Beijing Lenovo Software Ltd.

Beijing Sensetime Technology Development Co., Ltd.

Zizhou Jia

Zhigang Na

Ying Sun

Ding Liang

Hongmei Ge

A cooling fan and an electronic device are provided. The cooling fan comprises a plurality of blades disposed in a circumferential direction of a rotating shaft. The plurality of blades includes a first blade and a second blade. A windward surface of the first blade includes a first alignment part and a first offset part. The first alignment part is aligned with a windward surface of the second blade, and the first offset part and the windward surface of the second blade are arranged in a staggered manner.

Electronic device and cooling fan

Embodiments of the present disclosure provide method for processing images and apparatuses, method for identity verifications and apparatuses, electronic devices, and storage media. The method for processing images includes: obtaining first feature data of a first user image; comparing the first feature data with at least one piece of second feature data included in a database to obtain a comparison result; and determining, according to the comparison result, whether to update the database. According to the embodiments of the present disclosure, it is beneficial to the database to adapt to identity verification in different scenarios and changes in user's appearance generated over time, thereby improving the user experience.

Methods and apparatuses for processing image and identity verification, electronic devices, and storage media

A heat dissipation device and an electronic device thereof are provided. The heat dissipation device includes a heat dissipation body including a closed chamber; and at least two pumps in the closed chamber to drive heat dissipation medium contained in the closed chamber to flow in one or more loops.

Heat dissipation device and electronic device containing the same

An apparatus is disclosed that includes a heat pipe. The heat pipe includes a heat dissipation section arranged to dissipate heat using a fan. The heat pipe further includes a heat absorption section arranged to absorb heat from a heat source of an electronic device. The heat pipe further includes a heat dissipation medium disposed inside the heat pipe. The apparatus further includes a driving member coupled to the heat pipe and configured to drive the heat dissipation medium to flow circularly inside the heat pipe.

Heat dissipation apparatus and system for an electronic device

Embodiments of the application disclose a fan and a mold for making a fan blade structure for the fan. An embodiment of the fan comprises a fan blade structure and the fan blade structure comprises a mounting ring and a plurality of fan blades provided on the mounting ring, wherein mounting ring and the fan blades are integrally formed. The mold comprises a mounting ring and a plurality of fan blades provided on the mounting ring, the mold comprising a cavity having a ring-shaped channel configured for forming the mounting ring and a plurality of fan blade channels configured for forming the plurality of fan blades, in order to integrally form the fan blade structure.

Fan and mould for making the same

A fan and an electronic apparatus are disclosed. The fan comprises a housing and a blade wheel. The housing is shaped as a hollow column, a thickness of the housing is less than a preset thickness, a radial air inlet and an air outlet are disposed in a side of the housing, and the blade wheel is mounted in the housing and shaped as a cylinder. The housing is also provided with an axial air inlet disposed in at least one bottom surface of the housing so that air can enter the housing from the bottom surface by rotating the blade wheel. The heat dissipation performance of the fan is improved, the present invention solves the technical problem in the prior art that thinning of the fan in the super-thin electronic apparatus will lead to reduction in heat dissipation performance, and achieving technical effects that the electronic apparatus has high heat dissipation performance while super thinning the electronic apparatus.

Growing community of inventors

Beijing, China

Zizhou Jia