Globalfoundries Singapore Pte. Ltd.

Zishan Ali Syed Mohammed

Lulu Peng

Lawrence Selvaraj Susai

Chor Shu Cheng

Yong Chau Ng

Vinayak Bharat Naik

Nur Aziz Yosokumoro

Nuraziz Yosokumoro

An assembly is provided. The assembly includes a packaged semiconductor device and an outer enclosure enclosing the packaged semiconductor device. The packaged semiconductor device includes at least four opposing sides. The outer enclosure includes a magnetic material and a non-magnetic region arranged adjacent to the at least four opposing sides of the packaged semiconductor device.

Magnetic shielding of semiconductor devices

A semiconductor device may include: a substrate; a protective region provided over the substrate; and a core structure enclosed by the protective region. The core structure may include a core material etchable by a chemical solution. The protective region may include a protective material resistant to etching by the chemical solution. The core structure may have a first side and a second side opposite to the first side, the first side being closer to the substrate than the second side. The core structure may be narrowest at the first side of the core structure.

Semiconductor devices and methods of fabricating a semiconductor device

An inductive device may be provided, including a first winding layer, a second winding layer arranged over the first winding layer and connected to the first winding layer to form a plurality of turns around a first axis, and a magnetic core arranged vertically between the first winding layer and the second winding layer. The magnetic core may include a portion entirely over the first winding layer and entirely under the second winding layer, where this portion may include a magnetic segment and a non-magnetic segment arranged laterally adjacent to each other along the first axis.

Inductive devices and methods of fabricating inductive devices

A semiconductor device is provided. The semiconductor device comprises an inductor in a far back end of line layer and a capacitor adjacent to and electrically coupled with the inductor. The capacitor comprises a first electrode layer arranged over sidewalls and a bottom surface of a via in a first insulating layer A dielectric layer is provided over the first electrode layer. A second electrode layer is provided over the dielectric layer and a metal fill layer is provided over the second electrode layer. The metal fill layer has a top surface at least level with a top surface of the first insulating layer.

Inductor capacitor filter in far back end of line and integration schemes

An inductive device may be provided, including a substrate and an inductive structure arranged over the substrate. The inductive structure may include a bottom metal winding layer; a top metal winding layer arranged further away from the substrate than the bottom metal winding layer; a magnetic core layer arranged between the bottom metal winding layer and the top metal winding layer; a connector arranged to electrically connect the bottom metal winding layer and the top metal winding layer; and a top metal ring element arranged around the top metal winding layer, spaced apart from the top metal winding layer. The inductive device may further include a guard ring element arranged under the top metal ring element and around the magnetic core layer, spaced apart from the magnetic core layer; wherein the guard ring element may include a magnetic material.

Growing community of inventors

Singapore, Singapore

Zishan Ali Syed Mohammed