Generic Power Pte Ltd

Zin Oo Thant

Hak Wee Tang

Ruini Cao

Kok Yeow Lim

Xulei Yang

The present invention includes a system and method for three-dimensional imaging and analysis of electronic components. Specifically, it permits rapid and reliable inspection of the lead foot angle in integrated circuit packages. A first image capturing device, a second image capturing device and a third image capturing device are arranged in a 'corner shape' or 'L-shape.' The first image capturing device forms the corner and obtains an image of the bottom of the component. The perspective viewing angle of the second image capturing device and the perspective viewing angle of the third image capturing device are orthogonal to each other to allow accurate three-dimensional reconstruction of the lead angles and detection of flaws or bends.

System and method for lead foot angle inspection using multiview stereo vision

A method and apparatus for determining coplanarity of three-dimensional features on a substrate comprises a support for an object to be inspected in an object plane, a light source for illuminating the object, a first image capturing device having a first sensor and a first tiltable lens, a second image capturing device having a second sensor and a second tiltable lens, and an image processor to determine the coplanarity. Each tiltable lens is movable from a first variable angle to a second variable angle, with respect to its sensor, so that the respective lens plane and its sensor plane substantially intersect at the object plane in accordance with the Scheimpflug principle and the respective image is in focus across the whole field of view and of uniform light intensity.

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Singapore, Singapore

Zin Oo Thant