Growing community of inventors

Ningbo, China

Zilong Deng

Average Co-Inventor Count = 6.81

ph-index = 4

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 39

Zilong DengMingzhu Wang (21 patents)Zilong DengBojie Zhao (21 patents)Zilong DengNan Guo (21 patents)Zilong DengTakehiko Tanaka (21 patents)Zilong DengZhenyu Chen (21 patents)Zilong DengHeng Jiang (6 patents)Zilong DengZhen Huang (6 patents)Zilong DengZhongyu Luan (6 patents)Zilong DengFengsheng Xi (6 patents)Zilong DengYe Wu (2 patents)Zilong DengTakehiko Tanaka (6 patents)Zilong DengZilong Deng (21 patents)Mingzhu WangMingzhu Wang (160 patents)Bojie ZhaoBojie Zhao (146 patents)Nan GuoNan Guo (123 patents)Takehiko TanakaTakehiko Tanaka (110 patents)Zhenyu ChenZhenyu Chen (101 patents)Heng JiangHeng Jiang (69 patents)Zhen HuangZhen Huang (63 patents)Zhongyu LuanZhongyu Luan (34 patents)Fengsheng XiFengsheng Xi (22 patents)Ye WuYe Wu (15 patents)Takehiko TanakaTakehiko Tanaka (6 patents)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Ningbo Sunny Opotech Co., Ltd. (21 from 235 patents)


21 patents:

1. 11729483 - Photosensitive component, and camera module and manufacturing method therefor

2. 11627239 - Photosensitive assembly and camera module and manufacturing method thereof

3. 11575816 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

4. 11477354 - Camera module and molded circuit board assembly and manufacturing method thereof

5. 11388320 - Photosensitive component, and camera module and manufacturing method therefor

6. 11363184 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

7. 11223751 - Photosensitive assembly and camera module and manufacturing method thereof

8. 10986258 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

9. 10708480 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

10. 10666847 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

11. 10659664 - Camera module and molded circuit board assembly and manufacturing method thereof

12. 10582097 - Photosensitive assembly and camera module and manufacturing method thereof

13. 10498942 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

14. 10321028 - Photosensitive assembly and camera module and manufacturing method thereof

15. 10230879 - Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

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as of
12/16/2025
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