Rohm & Haas Electronic Materials LLC

Dow Global Technolgoies LLC

Zidong Wang

Michael K Gallagher

Christopher John Tucker

Gregory P Prokopowicz

Zhifeng Bai

Mark S Oliver

Elissei Iagodkine

Karen R Brantl

Matthew T Bishop

Joseph F Lachowski

Kevin Y Wang

Elissei Lagodkine

Compositions containing an adhesive material, a release additive and a compatibilizer are suitable for temporarily bonding two surfaces, such as a wafer active side and a substrate. These compositions are useful in the manufacture of electronic devices where a temporary bonding of a component to a substrate is desired.

Ephemeral bonding

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed poly(alkoxysilane). These compositions are useful in methods of improving the adhesion of coating compositions to a substrate.

Adhesion promoter

Arylcyclobutene polymers having improved toughness are provided. Compositions and methods for coating arylcyclobutene polymers having improved toughness are also provided.

Toughened arylcyclobutene polymers

Compositions useful for improving the adhesion of coating compositions, such as dielectric film-forming compositions, include a hydrolyzed amino-alkoxysilane having a protected amino moiety. These compositions are useful in methods of improving the adhesion of coating compositions to a substrate, such as an electronic device substrate.

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Southborough, MA, United States of America

Zidong Wang