Wiwynn Corporation

Zi-Ping Wu

Ting-Yu Pai

Li-Wei Chen

Yi Cheng

Wei-Ching Chang

Kang-Bin Mah

A package assembly includes a substrate, an electronic component and a cover. The electronic component and the cover are disposed on the substrate, wherein the electronic component is located within a chamber between the cover and the substrate. A cooling liquid may be filled in a heat dissipation space of the cover, so as to dissipate the heat generated by the electronic component. Furthermore, the cooling liquid may be filled in the chamber where the electronic component is located, so as to directly dissipate the heat generated by the electronic component.

Growing community of inventors

Taipei, Taiwan

Zi-Ping Wu