Hewlett-Packard Development Company, L.p.

Zhuqing Zhang

Silam J Choy

Chien-Hua Chen

Michael W Cumbie

David Ridgway Otis, Jr

Robert G Walmsley

Kevin E Swier

Alan R Arthur

Jennifer Wu

Sheldon A Bernard

David R Otis

Wallace Andrew Dingman

Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.

Encapsulating a bonded wire with low profile encapsulation

In one example, a vent includes multiple parts each having a different resistivity to passing a gas. The parts are arranged so that the gas may pass through all parts simultaneously as long as the parts remain permeable to the gas.

Vent

A device including a semiconductor, a substrate, and an interposer. The interposer is attached between the semiconductor and the substrate to absorb stresses between the semiconductor and the substrate.

Device including interposer between semiconductor and substrate

A display element for a display device includes a display mechanism and a resin layer. One or more busbars and one or more multiplexing resistors are disposed within the resin layer. The multiplexing resistors are communicatively connected to one or more address lines to permit the display element to be addressed by selective assertion of the address lines in a multiplexing manner.

Display device having multiplexing resistors within resin layer

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Corvallis, OR, United States of America

Zhuqing Zhang