Changsha University of Science and Technology

Zhuo Wen

Wei Li

Cong Mao

Kun Tang

Yongle Hu

Mingjun Zhang

Weidong Tang

Feng Shi

Yuanqiang Luo

Yinghui Ren

Gang Wu

Ziyang Chen

This paper describes an invention involving an electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials. The specific machining method is described below. A micro-grinding tool and an auxiliary electrode are respectively connected to the negative and positive electrodes of a pulsed DC power supply. When the current flows through the loop, an electrochemical hydrogen evolution reaction (HER) occurs at the micro-grinding tool in the grinding fluid, which generate multiple hydrogen bubbles. The bubbles coalesce into an insulating gas film and separate the micro-grinding tool from the grinding fluid; when the critical voltage is reached, the gas film is broken down and an electrochemical discharge occurs accompanied by discharge spark; under the action of the discharge spark, the surface material of the workpiece in the discharge-affected region is directly ablated to generate a heat-affected layer (HAL), namely, physical modification.

Electrochemical discharge-enabled micro-grinding process for micro-components of silicon-based materials

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Hunan, China

Zhuo Wen