Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Other

Zhuhui Li

Yong Fan

Yanfen Li

The present application provides a flexible micro-LED display panel and a manufacturing method thereof. The flexible micro-LED display panel includes a first base substrate, a thin film transistor array layer, a first connecting electrode layer, a second connecting electrode layer, a plurality of micro-LED chips, a flexible encapsulation layer, and a second base substrate, wherein the first base substrate and the second base substrate are flexible substrates, the second base substrate is provided on the flexible encapsulation layer covering the micro-LED chips to make a neutral layer of the panel to be located at the thin film transistor array layer, reducing a risk of wiring disconnection.

Flexible micro-LED display panel and manufacturing method thereof

A display panel and a manufacturing method thereof, and an electronic terminal are provided and including a driving circuit layer, a planarization layer, an electrode layer, and a light-emitting layer which are stacked from bottom to top. The driving circuit layer includes driving circuits. The planarization layer includes first planarization portions and second planarization portions which are arranged in a same layer. The electrode layer includes electrode groups. The light-emitting layer includes light-emitting devices. The first planarization portion is disposed on a side of the driving circuit close to the electrode layer, and the second planarization portion is disposed on a side of one of the electrode group close to the driving circuit layer. A thickness of the second planarization portion is greater than a thickness of the first planarization portion.

Display panel and manufacturing method thereof, and electronic terminal

A solder-printing stencil and a method of printing solder paste are provided in the present application. A solder-printing stencil is used for printing a solder paste on a substrate in cooperation with a squeegee blade, the solder-printing stencil includes: a stencil body including a first region, a second region, and a third region, wherein the third region is defined between the first region and the second region, the third region is provided with a plurality of mesh holes spaced along a squeegeeing direction of the squeegee blade; and protruding portions are provided on a side of the stencil body facing the substrate, and the protruding portions are provided on both the first region and the second region.

Solder-printing stencil and method of printing solder paste

A mini light-emitting diode (mini-LED) backlight module, a manufacturing method thereof, and a display panel are provided. A plurality of backlight partitions are defined on a flexible substrate to improve brightness uniformity. A plurality of mini-LEDs arranged in an array in each of the backlight partitions are formed into parallel modules, so that a driving voltage and current of the backlight module can be within an appropriate range. The flexible substrate is further arranged with a first metal pattern, and signals can be independently input to each of the mini-LEDs through each of first sub-metal patterns, reducing metal trace resistance of the backlight module, and further improving brightness uniformity of the backlight module.

Mini-led backlight module, manufacturing method thereof, and display panel

The transparent display includes a substrate and a plurality of frame traces. The substrate includes a transparent display region and a frame region defined on a left side, a right side, and an upper side of the transparent display region. The plurality of frame traces are disposed in the frame region, and each frame trace includes a hollow portion and a conductive portion surrounding the hollow portion. B disposing the hollow portion in each frame trace to improve a transmittance of each frame trace, thereby improving a transparency of the frame region, reducing a risk of disconnection, and improving a product yield.

Transparent display and manufacturing method thereof

A method of manufacturing a flexible array substrate, a flexible array substrate, and a flexible display device are disclosed. The method of manufacturing the flexible array substrate is implemented by using silver nanowire to form an electrically conductive pattern on a flexible substrate. In this manner, using the silver nanowire to replace metal or indium tin oxide as conventionally used to form the electrically conductive pattern can reduce trace resistance, increase panel transmittance, improve bending resistance of the flexible array substrate, avoid line breaks in products, improve production yield, and reduce manufacturing costs of products.

Method of manufacturing flexible array substrate, flexible array substrate, and flexible display device

The present invention discloses an array substrate, a display panel, and a manufacturing method of the display panel. The display panel includes the array substrate and a light-emitting element. The array substrate includes a substrate layer, a driving circuit layer, and a cover layer stacked in order from bottom to top. The cover layer is a gray light-absorbing material for absorbing ambient light and reflected light of the driving circuit layer.

Growing community of inventors

Shenzhen, China

Zhuhui Li