Foshan Nationstar Optoelectronics Co., Ltd. Corporation

Foshan Nationstar Optoelecronics Co., Ltd.

Zhuang Peng

Kuai Qin

Chuanbiao Liu

Feng Gu

Kailiang Fan

Ling Li

Heng Guo

Xiaofeng Liu

Bin Cai

Lu Yang

Danwei Li

Hu Xu

Aidi Chen

Hongxin Chen

Shaojia Xie

Caineng Huo

Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.

LED display unit group and display panel

A manufacturing method for an integrated chip is used for forming and processing an electrode structure of the integrated chip. The method includes step Sand step S. In step S, a light-emitting portion is manufactured, and the light-emitting portion includes multiple light-emitting unit groups distributed in the form of a matrix. In step S, conductive terminals multiple first electrodes and conductive terminals of multiple second electrodes of the light-emitting portion are electrically led out to form multiple first pin electrodes and multiple second pin electrodes. The first pin electrodes and the second pin electrodes are used for being electrically connected to a circuit substrate.

Integrated chip and manufacturing method therefor, and full-color integrated chip and display panel

Provided are an LED holder, an LED device and an LED display screen. The LED holder includes a metal frame and a cup cover wrapping the metal frame. The cup cover includes a reflective cup. The cup cover has a first lateral surface and a second lateral surface disposed opposite to each other. A height of the first lateral surface is greater than a height of the second lateral surface. The metal frame includes metal pins exposed outside the cup cover and disposed on the first lateral surface and/or the second lateral surface. The bottom of the cup cover is of a sloping structure, so that the light emitted by an LED chip in the reflective cup propagates along a specified direction.

LED holder, LED device and LED display screen

An LED device, a method for manufacturing an LED device, and an LED display module are provided. The LED device includes an LED bracket, an LED chip and an encapsulation sealant. The LED bracket includes a metal bracket and a cup cover encasing the metal bracket. The cup cover includes a reflective cup having a cavity. The LED chip is fixed in the cavity of the reflective cup. The cavity of the reflective cup is filled with the encapsulation sealant. The encapsulation sealant includes an under sealant and a surface sealant. The under sealant covers the LED chip, and the surface sealant covers the under sealant. The under sealant is a transparent layer. The surface sealant is a matte layer.

LED device, method for manufacturing an LED device, and LED display module

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Foshan, China

Zhuang Peng