Texas Instruments Corporation

Longtel Inc.

Zhuang Ma

Danyang Zhu

Wei Zhao

Zhong Yu Chen

Abha Singh Kasper

Jianhua Feng

Long Wen

Xinyu Yin

Michael Dean Shilhanek

Jinghui Wang

Steven Bolen

Weihai Zheng

Albert Eardley

An embodiment of the present disclosure provides a visual real-time interaction method for software defined networking (SDN). According to this method, a visual interface is established for the SDN. The visual interface includes at least one first node indicative of a port of a switch and at least one second node indicative of a port of a service provider. The first node and the second node are distributed on at least one stack hub. A connection is established between the first node and the second node. The connection has a curvature different from a curvature of the stack hub, and at least an extension line of the connection intersects with the stack hub. A location corresponding to the port of the switch and a location corresponding to the port of the service provider and an attribute of the connection are determined according to the connection.

Visual real-time interaction method and system for software defined networking

An apparatus includes an integrated circuit, a plurality of bi-directional pins, and an electro-static discharge (ESD) clamp. The integrated circuit is configured to provide a ground potential. The plurality of bi-directional pins are configured to provide a differential input signal for the integrated circuit. The electro-static discharge (ESD) clamp is coupled between the ground potential and the plurality of bi-directional pins.

Method and circuitry for on-chip electro-static discharge protection scheme for low cost gate driver integrated circuit

A multichip module (MCM) device include a first die including functional circuitry bonded by a plurality of inter-die bond wires (bond wires) to a second die having functional circuitry. A first channel (Channel A) and second channel (Channel B) each have separate top and bottom signal paths (signal paths) including one of the bond wires. A failure of any of the signal paths does not affect functionality of the device. The first die includes input pins including a first input pin (P), a second input pin (P), and coupling circuitry including cross-channel test circuitry positioned between the input pins and the functional circuitry. The coupling circuitry provides for Channel A and Channel B a first configuration for normal mode operation and a second configuration for test mode operation for single bond wire testing for checking continuity of any of the bond wires.

Multi-channel MCM with test circuitry for inter-die bond wire checking

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Beijing, China

Zhuang Ma