Capitalbio Corporation

National Center for Advanced Packaging Co., Ltd

Tsinghua University

Chinese Academy of Sciences

Zhongyao Yu

Jing Cheng

Jing Zhu

Wanli Xing

Guangxin Xiang

Yu Sun

Xia Tian Zhang

Yuxiang Zhou

Yuming Hu

Liangbin Pan

Xueping Guo

Xueling Quan

Lihua Huang

Zhidan Fang

A method for constructing an external circuit structure is provided. The method is applied to an inner circuit substrate, wherein, the method comprises: laminating a copper foil and a prepreg on the inner circuit substrate; wherein, the prepreg is laminated between the copper foil and the inner circuit substrate; drilling at least one blind via from the copper foil to reach the copper circuit of the inner circuit substrate; removing smear generated in the at least one blind via during the drilling process; corroding off the copper foil; electroless copper plating on the prepreg to form an electroless plating copper layer on the prepreg; wherein, during the electroless copper plating process, a swelling process without desmearing process is implemented.

Method for constructing an external circuit structure

An active chip package substrate and a method for preparing the same. The active chip package substrate includes: a core board; at least one upper active chip, embedded in the core board and having an active surface facing toward a lower surface of the core board, the upper active chip being an active bare chip; and at least one lower active chip, embedded in the core board and having an active surface facing toward an upper surface of the core board, the lower active chip being an active bare chip.

Active chip package substrate and method for preparing the same

A chip embedded package method is provided by an embodiment of the present invention. The method comprises: etching metallic sinks on the thicker metal layer of each organic substrate; part of metallic sinks is used for packaging at least one chip, and other metallic sinks are used for via-holes; mounting the at least one chip into a metallic sink of each organic substrate via adhesive; flipping one organic substrate on another to form a combination; drilling blind-holes on both sides of the combination of the two organic substrates to pass through the adhesive; drilling via-holes to get through the combination of the two organic substrates, wherein the via-holes locates beyond the metallic sinks with chips; filling the blind-holes and via-holes with conductive medium through an electroplating process.

Chip embedded package method and structure

Among others things, techniques, systems, and apparatus are disclosed for recording electrophysiological signals. In one aspect, a microelectrode sensing device includes a printed circuit board (PCB), a chip unit electrically connected to the PCB, and a cell culture chamber positioned over the chip unit and sealed to the PCB with the chip unit between the PCB and the cell culture chamber. The chip unit includes a substrate; a conductive layer positioned over the substrate that includes one or more recording electrodes; an insulation layer positioned over the conductive layer; another conductive layer positioned over the insulation layer that includes positioning electrodes; and another insulation layer positioned over the other conductive layer. The recording and positioning electrodes are electrically independent so as to independently receive a stimulus signal at each recording electrode and positioning electrode and independently detect a sensed signal at each recording electrode.

Microelectrode arrays

A microelectrode sensing device includes a substrate and an array of microelectrode sensors. Each sensor includes a first conductive layer that at least partially conducts electricity. The first conductive layer is formed above the substrate and patterned to include a recording electrode that measures electrical activities of target cells. Each sensor also includes a second conductive layer that at least partially conducts electricity. The second conductive layer is elevated above the first layer and patterned to include multiple positioning electrodes arranged to define a sensing region above the recording electrode. The positioning electrodes are designed to generate an electric field pattern in the sensing region to move and confine the target cells to a sub-region of the sensing region that at least partially overlaps the recording electrode.

Automatic positioning and sensing microelectrode arrays

Growing community of inventors

Beijing, China

Zhongyao Yu