Dow Silicones Corporation

Zhongwei Cao

Yan Zheng

Yan Huang

Don Lee Kleyer

Rui Yang

Qiang Huang

Tassie Andersen

Sandrine Teixeira De Carvalho

Lujing Xie

A composition contains: (a) a vinyl-functional polysiloxane; (b) a silyl hydride functional polysiloxane having on average at least two silyl hydride groups per molecule; (c) 60 to 92 weight-percent thermally conductive filler; (d) a platinum hydrosilylation catalyst; and (e) 0.05 to 2.0 weight-percent of a trialkoxy-functional polysiloxane; where the trialkoxy-functional polysiloxane has two or more trialkoxy functionalities per molecule and a number average molecular weight of 1200 or more and where weight-percents are relative to the composition weight.

Curable thermally conductive polysiloxane composition with increased thixotropic index

A thermally conductive silicone composition is provided. The composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane having an average of two to four silicon-bonded hydrogen atoms in a molecule, wherein an amount of the silicon-bonded hydrogen atoms in component (B) is 0.2 to 5 moles per mole of the alkenyl groups in component (A), and at least two of the silicon-bonded hydrogen atoms are located on the side chains of the molecule; (C) a hydrosilylation reaction catalyst; (D) a thermally conductive filler; (E) an alkoxysilane having an alkyl group containing 6 or more carbon atoms in a molecule; and (F) glass beads. A thermally conductive member is produced from the thermally conductive silicone composition. An electronic device has the thermally conductive member and a manufacturing method of the electronic device includes using the thermally conductive silicone composition.

Thermal gap filler and its application for battery management system

A composition comprising: (A) an organopolysiloxane, (B) a filler and (C) a filler treatment agent, comprising a mixture of two organopolysiloxanes having the general formulas (I) and (II), RRRSi&#x2014;[(CH)(MeSiO)]&#x2014;[O-(MeSiO)]-(MeSi)(CH)(MeSiO)&#x2014;(CH)&#x2014;Si(OR)(I), wherein 'Me' is methyl group, R, Rand Rare independently selected from an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 2 to 4 carbon atoms, an alkoxy group having 1 to 3 carbon atoms or &#x2014;(OSiRRR), in which R, Rand Rare independently selected from an alkyl group having 1 to 4 carbon atoms, Ris an alkyl group having 1 to 4 carbon atoms, n1, n2, m1, m3 and o are integers from 1 to 200, m2, n3, r and p are integers from 0 to 200, r and p are not 0 at the same time, (RO)Si&#x2014;[(CH)(MeSiO)]&#x2014;(CH)&#x2014;[O-(MeSiO)]-(MeSi)o-(CH)-(MeSiO)&#x2014;(CH)&#x2014;Si(OR)(II), wherein Rand Rare an alkyl group having 1 to 4 carbon atoms, n1, m1, m3, o and n2 are integers from 1 to 200, n3, n4, m2, r and p are integers from 0 to 200, r and p are not 0 at the same time.

Silicone composition comprising filler

Growing community of inventors

Shanghai, China

Zhongwei Cao