Semitool, Inc.

Zhongmin Hu

Kyle Moran Hanson

Gregory J Wilson

Paul R McHugh

Thomas Lee Ritzdorf

Lyndon W Graham

Robert W Batz, Jr

Nolan Layne Zimmerman

Rajesh Baskaran

Eric Young

The present invention is directed to methods and compositions for depositing a noble metal alloy onto a microelectronic workpiece. In one particular aspect of the invention, a platinum metal alloy is electrochemically deposited on a surface of the workpiece from an acidic plating composition. The plated compositions when combined with high-k dielectric material are useful in capacitor structures.

Platinum alloy using electrochemical deposition

Apparatus and method for thermally controlled processing of microelectronic workpieces with liquids. An apparatus in accordance with and embodiment of the invention includes a process vessel configured to carry a processing liquid, such as an electroless processing liquid. The vessel has a thermally transmissive wall for transferring heat to and/or from the processing liquid within. A heat transfer device, such as a reservoir that receives processing liquid spilling over from the process vessel, transfers heat to or from the processing liquid within the process vessel. The heat transfer device can also transfer heat to or from an internal or external heat source, such as a conduit carrying a heat transfer fluid, or an electrical resistance heater. The interaction between the microelectronic workpiece and the processing liquid can be further controlled by controlling the rate at which the microelectronic workpiece rotates and/or the manner in which the microelectronic workpiece is introduced to and/or withdrawn from the processing liquid.

Apparatus and method for thermally controlled processing of microelectronic workpieces

An aqueous thiourea-free gold etching bath for electrolytically etching gold from a microelectronic workpiece. One embodiment of the aqueous thiourea-free bath contains: (a) about 0.5&#x2013;1.5 M iodide; (b) about 0.1&#x2013;0.3 M sulfite; and (c) about 1.0&#x2013;3.0 g/L wetting agent. The bath is useful in a process for electrolytically etching gold from a microelectronic workpiece. A tool system in which the baths and processes of the present invention may be used is also described.

Thiourea- and cyanide-free bath and process for electrolytic etching of gold

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Kalispell, MT, United States of America

Zhongmin Hu