Lam Research Corporation

Zhonghui Alex Wang

Yezdi N Dordi

Fritz C Redeker

Mikhail Korolik

Arthur M Howald

William Thie

Praveen Nalla

John Boyd

John M Boyd

Tiruchirapalli Arunagiri

Tiruchirapalli Arunagirí

Methods for cleaning semiconductor wafers following chemical mechanical polishing are provided. An exemplary method exposes a wafer to a thermal treatment in an oxidizing environment followed by a thermal treatment in a reducing environment. The thermal treatment in the oxidizing environment both removes residues and oxidizes exposed copper surfaces to form a cupric oxide layer. The thermal treatment in the reducing environment then reduces the cupric oxide to elemental copper. This leaves the exposed copper clean and in condition for further processing, such as electroless plating.

Thermal methods for cleaning post-CMP wafers

Growing community of inventors

San Jose, CA, United States of America

Zhonghui Alex Wang