Visteon Global Technolgoies, Inc.

A123 Systems LLC

Visteon Global Tech., Inc

University of Michigan

Zhong-You Joe Shi

Chuanjing Xu

Larry Beck

Maha Hammoud

Jennifer Wilson

Jay DeAvis Baker

Richard Keith McMillan

Peter Joseph Sinkunas

Lakhi Nandlal Goenka

Delin Li

Raoul Kopelman

Lawrence LeRoy Kneisel

Bernard A Meyer

Weihong Tan

Andrew Zachary Glovatsky

Robert Edward Belke

Myron Lemecha

Harvinder Singh

Charles Frederick Schweitzer

Stephen Fuks

David James Steinert

Rexanne M Coyner

C Allen Marlow

Lawrence L Bullock

Raymond Eric Foster

Lakhi Nandal Goenka

Beck Larry

An LFP electrode material is provided which has improved impedance, power during cold cranking, rate capacity retention, charge transfer resistance over the current LFP based cathode materials. The electrode material comprises crystalline primary particles and secondary particles, where the primary particle is formed from a plate-shaped single-phase spheniscidite precursor and a lithium source. The LFP includes an LFP phase behavior where the LFP phase behavior includes an extended solid-solution range.

High power electrode materials

A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.

Electrical circuit board and method for making the same

A signal transmission system comprising a signal conduction matrix formed into a shape that allows transmission of a signal through the matrix using at least one surface signal router, at least one signal source operatively connected to a surface of the matrix and that generates a signal that propagates through matrix, and at least one signal receiver operatively connected to a surface of the matrix and that receives the signal from the signal source. The signal may be coded, modulated, frequency-converted, or amplified. The surface signal router can be a reflective coating, an indentation, a pressure fit structure, or at least one inclined cut on the surface of the matrix. A frequency-selective filter can be used to allow selective detection by a target signal receiver. The invention is also directed to various method of transmitting a signal using a signal conduction matrix.

Communication system with a signal conduction matrix and surface signal router

An optical fiber lighted instrument panel includes an instrument panel having at least one portion to be illuminated disposed in a vehicle. The optical fiber lighted instrument panel contains at least one optical fiber with at least one predetermined aperture formed in the cable by selective application to specific areas to the core of the optical fiber cable, thus allowing light to emit from the optical fiber cable and illuminate the desired areas of the instrument panel. The optical fiber lighted instrument panel further includes the addition of high-refractive index paint to achieve uniform and assorted colors of light emitting from the optical fiber. The invention further includes the addition of a wheel with various colored filters attached in-line between the light source and the inlet of the optical fiber to allow the user to select what color they desire to be illuminated from the cable.

Fiber optic lighted instrument panel

A non-mechanical fluid level sensor based on light communication channel (LCC) technology. In a preferred embodiment, one end of the LCC is connected to a signal source while another end is connected to a sensor. The LCC is dipped in a fluid container and a signal propagates and undergoes internal reflection through the LCC towards one of its ends which is connected to the sensor. The fluid level is detected preferably by measuring the intensity of the signal reflected with the LCC that reaches a sensor. Different fluid levels preferably correspond to linearly varying detected signal intensities. A main LCC bus may communicate remotely with the sensor without wiring or other electrical connectors.

LCC-based fluid-level detection sensor

A method to solder flex circuits by diode laser. First and second flex circuits composed of polymer flex substrate are provided. Each flex circuit has a top and a bottom side and at least one contact trace embedded in its surface. An area of solder is provided on the contact trace of at least one of the flex circuits and the flex circuits are positioned so that the contact traces of each flex circuit are substantially aligned. A laser beam is positioned to heat the contact trace to melt the solder and fuse the contacts.

Flex to flex soldering by diode laser

A new system and method for repairing flexible circuits is disclosed. The flexible circuits conduct electrical signals to and from electronic devices. The system generally includes a flexible circuit substrate, at least one electrical conductor, and a repair patch. The flexible circuit substrate has a cut zone and a repair zone. The at least one electrical conductor is supported by the flexible circuit substrate. The electrical conductors are configured to carry electrical signals. The repair patch is used to electrically interconnect at least two repair zones.

System and method for repairing flex circuits

An integrated control system comprising an integrated circuit that controls at least one component or subsystem of an engine and a first light source that generates a first light signal when triggered through the integrated circuit. The first light signal propagates from the first light source through an LCC that may also serve as a substrate, wherein the signal that actuates the component of the engine can be the first light signal or a signal generated after the first light signal is produced. The component or subsystem of the engine may be an ignition system or a fuel injection system. The present invention is also directed to a method of controlling a component or subsystem of an engine.

Optically controlled IPCS circuitry

A method for making multi-layer circuit boards having metallized apertures which may be selectively and electrically grounded and having at least one formed air-bridge

Circuit board and a method for making the same

Method of making a circuit board

A multi-layer circuit board with heat pipes and a method forming a multi-layer circuit board with heat pipes is disclosed. The circuit board includes a heat pump which communicates with the heat pipe to circulate an amount of cooling material within the heat pipe effective to efficiently dissipate heat from the circuit board.

A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.

Growing community of inventors

Ann Arbor, MI, United States of America

Zhong-You Joe Shi