Chengdu Boe Optoelectronics Technology Co., Ltd.

Boe Technology Group Co., Ltd.

Sandisk Information Technology (shanghai) Co., Ltd.

International Business Machines Corporation

Sandisk Semiconductor (shanghai) Co. Ltd.

Other

Beijing Boe Technology Development Co., Ltd.

Zhong Lu

Cheeman Yu

Xingliang Xiao

Zhenrui Fan

Yu Zhang

Yao Huang

Chin-Tien Chiu

Donghua Jiang

Weiyun Huang

Benlian Wang

Yuanyou Qiu

Jianchang Cai

Wei Gu

Li Gao Xiong

Chin Tien Chiu

Hem P Takiar

Lili Du

Li Ping Wang

Wei Hu

Yuanjie Xu

Wei Lin

Tianyi Cheng

Jia Tao Li

Ning Ye

Seungmin Lee

Chi Yu

Yuanzheng Guo

Suresh Kumar Upadhyayula

Cheng Tang

Jianbo Yang

Long Jiang

Yu Song

Fujiang Jin

Weili Wang

Liang Song

Fen Yu

Ye Bai

Kim Lee Bock

Pengyu Liao

Yuan Chen

Zhongli Ji

Byung Chun Lee

Weiting Jiang

Mingwen Wang

Jun Yu

Shao Yang Yu

Wenxuan Zhang

Jian Hong Shan

Yongjie Tang

Chenlin Yin

Shuohua Chen

Peng Fu

Zhaoyang Song

Hongguang Yuan

Kaiyou Qian

Fuqiang Xiao

Cheng Zhao

Xiaodan Wei

King Hoo Ong

Shiv Kumar

Dacheng Huang

Gursharan Singh

Xiaoguang Chen

Yuanjiang Yang

Lijuan Huang

Xingqiang Zhang

Dongkoog Jang

Yuang Zhang

Enyong Tai

Ze Rui Yuan

Yan Liang Qiao

Yamei Zhou

Fuqiang Lin

Shengzhou Gao

Beum Ku Park

Pradeep Kumar Rai

ByungChun Lee

Shan Luo

En-Yong Tai

Min Ni

Li Xiong

Matthew Chen

A display substrate and a display device are provided. The display substrate includes a display region including light emitting units; the light emitting units are arranged into light emitting unit rows, and the light emitting units in one of the light emitting unit rows are arranged along a first direction; the light emitting units include first light emitting units. In at least part of the display region: distances, in the first direction, between a light emitting region of one first light emitting unit and light emitting regions of two of the first light emitting units adjacent to the one first light emitting units are different, and/or distances, in a second direction, between a light emitting region of one first light emitting units and the light emitting regions of two of the first light emitting units adjacent to the one first light emitting units are different.

Display substrate with protruding display region edge, and display device

Embodiments of the disclosure disclose a display substrate, a manufacturing method thereof and a display apparatus. The display substrate includes: a base, having a wire routing region; a first wire routing layer, located on the base, where the first wire routing layer in the wire routing region includes a plurality of first routing wires arranged at intervals, and a space between adjacent first routing wires is smaller than 2 um; an insulation layer, located on a side of the first wire routing layer facing away from the base and having a plurality of first via holes corresponding to the first routing wires; a first flat layer, located on a side of the insulation layer facing away from the base and having second via holes corresponding to the first via holes, where the second via holes at least partially overlap with the first via holes.

Display substrate, manufacturing method thereof, and display apparatus

A display panel, a manufacturing method thereof and a display device. The display panel includes a first region and a second region. The second region includes a driving circuitry layer and a first light-emitting unit located on a base substrate, the first region includes a plurality of second light-emitting units located on the base substrate, the second light-emitting unit is electrically coupled to the driving circuitry layer through a transparent conductive layer, the transparent conductive layer includes at least two conductive sub-layers laminated one on another and insulated from each other, each conductive sub-layer includes at least one transparent conductive line, and each transparent conductive line is coupled to a corresponding second light-emitting unit.

Display panel, manufacturing method thereof, and display device

An Organic Light-Emitting Diode display substrate and a preparation method thereof. The Organic Light-Emitting Diode display substrate includes: a first flexible organic layer; a first inorganic layer on the first flexible organic layer; a second flexible organic layer on the first inorganic layer; a pixel driving circuit layer on the second flexible organic layer; a light-emitting element layer on the pixel driving circuit layer, and a thickness of the first flexible organic layer is 5 μm-20 μm, a thickness of the first inorganic layer is 0.4 μm-0.5 μm, and a thickness of the second flexible organic layer is 5 μm-20 μm.

Display substrate motherboard and preparation method thereof, display substrate and preparation method thereof

A display panel, a manufacturing method thereof and a display device are provided. The display panel includes a base substrate, the base substrate includes a display region and a peripheral region surrounding the display region, the base substrate includes a first substrate layer, a third substrate layer and a second substrate layer which are sequentially stacked, a material of the second substrate layer includes amorphous silicon. The display region includes a transparent display region, the transparent display region includes a pixel region and a light transmission region, and a thickness of the second substrate layer located in the light transmission region is less than a thickness of at least part of the second substrate layer located outside the transparent display region.

Display panel, manufacturing method thereof and display device

A display substrate motherboard and a preparation method thereof, a display substrate and a preparation method thereof are disclosed. The display substrate motherboard includes a base substrate, a first flexible organic layer, a first inorganic layer, a second flexible organic layer and a pixel driving circuit layer. The pixel driving circuit layer includes a plurality of pixel driving circuit portions respectively used for a plurality of display substrates, and the plurality of pixel driving circuit portions are insulated from each other. An orthogonal projection of the second flexible organic layer on the base substrate is located inside an orthogonal projection of the first inorganic layer on the base substrate. An orthogonal projection of each of the pixel driving circuit portions on the base substrate is located inside the orthogonal projection of the second flexible organic layer on the base substrate.

Embodiments of the present invention relate to methods, systems, and computer program products for file management in a distributed file cache system. In some embodiments, a method is disclosed. According to the method, responsive to determining that at least one client node is obtaining a file of a first version stored at a storage node, one or more processors generate contact information indicating that the file of the first version is accessible from the storage node and the at least one client node and recorded the contact information into a distributed hash table. The storage node and the at least one client node are included in a plurality of nodes associated with the distributed hash table. Further, one or more processors generate first version information indicating that the file is of the first version and record the first version information into a blockchain associated with the plurality of nodes.

Distributed file cache

This disclosure provides a deaeration apparatus comprising: a closable deaeration cavity configured to accommodate a liquid to be deaerated; a heating member configured to heat the deaeration cavity; a temperature detection member configured to detect a temperature inside the deaeration cavity; and a controller configured to receive the temperature detected by the temperature detection member and control the heating member based on the temperature. When using in deaeration of a liquid, the deaeration apparatus of the disclosure can shorten the deaeration time and improve the deaeration efficiency of the liquid.

Deaeration apparatus

A curing apparatus and a curing method are provided. The curing apparatus comprises: a chamber, configured for accommodating a substrate provided with a polyimide adhesive; an air extracting unit, configured for evacuating the chamber; and a heating unit, configured for performing a first heating on the substrate in the case that a first predetermined pressure is reached in the chamber during a evacuating process of the air extracting unit so as to remove organic gases from the polyimide adhesive, and performing a second heating on the substrate after the first heating so as to cure the polyimide adhesive.

Curing apparatus and curing method

A method for fabricating an array substrate, an array substrate and a display device are provided. The method for fabricating the array substrate includes: forming a spacer layer on the array substrate, the spacer layer is disposed under a planarized layer and corresponds to a location of a via hole in the planarized layer, wherein the planarized layer is formed of a hot melt material.

Method for fabricating array substrate, array substrate and display device

A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Semiconductor device including independent film layer for embedding and/or spacing semiconductor die

A wire bonded structure for a semiconductor device is disclosed. The wire bonded structure comprises a bonding pad; and a continuous length of wire mutually diffused with the bonding pad, the wire electrically coupling the bonding pad with a first electrical contact and a second electrical contact different from the first electrical contact.

Waterfall wire bonding

Disclosed is exposure machine, comprising: a loading frame, for placing an object to be exposed; a light source device, located at one side of a plane where the loading frame is positioned, wherein the light emitting direction of the light source device is perpendicular to a plane where the object to be exposed is positioned. During exposure, the loading frame will not reflect the light transmitting through the object to be exposed, and thus the stage spots are avoided. Further, when the exposure machine is operated in a vertical manner, a bidirectional exposure may be achieved only by adding a single prism into the light source device in the prior art, and thus the exposure efficiency is greatly improved.

Exposure machine

A memory device including a metallic layer shielding electromagnetic radiation and/or dissipating heat, and a method of making the memory device, are disclosed. The metallic layer is formed on a metallic layer transfer assembly. The metallic layer transfer assembly and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the metallic layer is transferred from the shield to the encapsulated memory device.

EMI shielding and thermal dissipation for semiconductor device

Growing community of inventors

Shanghai, China

Zhong Lu