Nanyang Technological University

Siemens Gamesa Renewable Energy Innovation & Technology S.l.

Osram Opto Semi-Conductors Gmbh Co. Ohg

Kenvue Brands LLC

Zhong Chen

Srikanth Narasimalu

Weng Chye Jeffrey Ho

Xinghua Wu

Jose Luis González Moral

Pushkar Dilip Kanhere

Rosario Martínez Ortigosa

Ewald Karl Michael Guenther

Jijie Zhou

Yu Hua Cheng

Yuxin Tang

Zhili Dong

Kye Yak See

Brian Cotterell

Eng Kee Chua

Pushkar Kanhere

Jose Luis Gonzales Moral

Jeffrey Weng Chye Ho

Rosario MARTÍNEZ Ortigosa

Si Jia Jasmine Tan

Polymeric compositions useful in preventing the frost or ice deposition in the surface of wind turbine generator blades present in a cold climates or high altitude are provided. In addition to the anti-icing capacity, the polymeric composition prevents the deposition of dirt, i.e. it has self-cleaning properties.

Polymeric composition with anti-icing and self-cleaning properties

The invention provides a composite laminate comprising an outer, an intermediate and an inner section comprising, respectively, first layers of composite material and one or more functional layers having a printed circuit for absorbing the electromagnetic radiation incident on the composite laminate; second layers of composite material; a conducting layer contiguous to the intermediate section and third layers of composite material. The values of the resistivity of the functional layer and the thickness of the intermediate section are comprised in predefined ranges for the attenuation of the reflection of electromagnetic radiation of the composite laminate in the S or X bands up to a peak of &#x2212;20 dB. The invention also refers to manufacturing methods of the composite laminate () and to wind turbine blades including the composite laminate.

Microwave absorbing composite for turbine blade applications

The present invention relates to a photocatalytically active nanoparticulate material. A nanoparticle of the invention is a composite nanoparticle having two crystalline phases: hydrogen titanate and titania, which are uniformly mixed in the nanoparticle. The invention also relates to forming a nanoparticulate composite material by heating a basic titania sol under solvothermal conditions.

Titanate / titania composite nanoparticle

The present invention refers to a method of manufacturing layered metal oxide particles, the method comprising: placing a metal electrode in an electrolyte; and applying an electrical voltage to the electrode, wherein the metal electrode forms the anode, to form a metal oxide layer on the electrode surface, wherein the electrical voltage applied is higher than the breakdown voltage of the metal oxide, thereby breaking down the metal oxide layer formed on the electrode surface into metal oxide particles that react with the electrolyte to form the layered metal oxide particles. The present invention also refers to a layered metal oxide particle obtained from the method, and a method of manufacturing a crystalline metal oxide nanosheet or a crystalline metal oxide nanoribbon.

Method of manufacturing layered metal oxide particles and layered metal oxide particles formed thereof

The present invention relates to a method of forming a wire bond-free conductive interconnect area on a semiconductor substrate. A semiconductor substrate with an electrically conductive protrusion, defining a bond pad, is provided as well as a plurality of carbon nanotubes. The plurality of carbon nanotubes is immobilized on the bond pad by allowing at least one random portion along the length of the carbon nanotubes to attach to the surface of the bond pad. Thus an aggregate of loops of carbon nanotubes is formed on the surface of the bond pad. Thereby a conductive interconnect area is formed on the electrically conductive protrusion without heat treatment.

Method of forming an interconnect on a semiconductor substrate

A method of fabricating a device, including mechanically patterning a device layer using a stamp containing a desired pattern. The device layer is formed on a plastic or polymeric substrate. The stamp is pressed against the substrate under a load which patterns the device layer without cracking the device layer in the non-patterned areas.

Mechanical patterning of a device layer

Growing community of inventors

Singapore, Singapore

Zhong Chen