Aeva, Inc.

Zhizhong Tang

Pradeep Srinivasan

Kevin Kinichi Masuda

Wenjing Liang

Bing Shen

Embodiments of the present disclosure include method for sequentially mounting multiple semiconductor devices onto a substrate having a composite metal structure on both the semiconductor devices and the substrate for improved process tolerance and reduced device distances without thermal interference. The mounting process causes 'selective' intermixing between the metal layers on the devices and the substrate and increases the melting point of the resulting alloy materials.

System and apparatus for sequential transient liquid phase bonding

An optical sub-assembly includes a diode submount structure, a diode mounted to the diode submount, and a thermoelectric cooler (TEC). The TEC is in thermal contact with the diode, and the diode is positioned between the diode submount structure and the TEC.

Techniques for device cooling in an optical sub-assembly

A light detection and ranging (LIDAR) system and apparatus including a photonics chip mounted to a substrate, the photonics chip including one or more optical components and one or more electrical components and one or more integrated circuit (IC) chips mounted to the photonics chip to process an electrical signal generated by the one or more optical components and the one or more electrical components, wherein the one or more IC chips are physically separated from the substrate to reduce crosstalk on the LIDAR apparatus.

Techniques for compact LIDAR system

A light detection and ranging (LIDAR) system and apparatus including a photonics chip coupled to a substrate, the photonics chip including an optical source to generate an optical beam, a waveguide to direct the optical beam through the photonics chip, a photodetector to generate an electrical signal in response to detecting a return signal, and an optical coupler to transmit the optical beam from the waveguide to a target in the field of view of the LIDAR apparatus. The system and apparatus may further include an integrated circuit (IC) chip coupled to the photonics chip, the IC chip to process the electrical signal generated by the photodetector.

Growing community of inventors

San Carlos, CA, United States of America

Zhizhong Tang