Zhejiang Kaiying New Materials Co., Ltd.

Applied Materials, Inc.

Twin Creeks Technologies, Inc.

Pharos Materials, Inc.

Gtat Corporation

Zhiyong Li

Mohamed M Hilali

Gopalakrishna B Prabhu

Venkatesan Murali

Christopher John Petti

Theodore H Smick

Kathy Jackson

Jifeng Wei

Yaping Zhang

Xiangling Xu

David Tanner

Zhang Wei

Jianshe Tang

Salvador P Umotoy

Vinay K Shah

Wei Guang Lu

Yong Liu

Bo Xie

Danny Cam Toan Lu

Gopal Prabhu

Jeffrey S Sullivan

Yacov Elgar

Garry K Kwong

Tai T Ngo

Dhruv Gajaria

Michael Marriott

Chuck Luu

John Visitacion

Peter Crundwell

Ho Gene Choi

Dennis C Pierce

Mohamed H Hilali

Intermediate temperature metallization pastes containing vanadium are disclosed. The metallization pastes can be used to fabricate electrodes interconnected to a transparent conductor.

Vanadium-containing electrodes and interconnects to transparent conductors

Peripheral side surface interconnects for interconnecting solar cells are disclosed. The peripheral side surface interconnects include a layer of an electrically conductive adhesive overlying an insulating layer overlying a peripheral side edge of a solar cell and electrically interconnected to a busbar. Photovoltaic modules include adjacent solar cells comprising peripheral side surface interconnects interconnected by the electrically conductive adhesive or by the electrically conductive adhesive and an interconnection element. An interconnection element can be a solder paste or a solder containing electrically conductive ribbon. Methods of forming solar cell peripheral side surface interconnects include applying an insulating layer to a side surface of a solar cell, depositing a busbar in proximity to the insulated side surface of the solar cell, depositing an electrically conductive adhesive over at least a portion of the busbar and over at least a portion of the insulating layer. Photovoltaic modules can be formed by interconnecting adjacent solar cells using a peripheral side surface interconnect.

Solar cell side surface interconnects

Edge interconnects for interconnecting solar cells are disclosed. The edge interconnects include a layer of an electrically conductive adhesive overlying an insulating dielectric layer applied to edge of a solar cell and electrically interconnected to a busbar. Solar cell modules include adjacent solar cells comprising edge interconnects interconnected using an interconnection element. An interconnection element can be a solder paste or a solder containing electrically conductive ribbon. Methods of forming solar cell edge interconnects include applying an insulating dielectric coating to edges of a solar cell, depositing a busbar in proximity to the insulated edges of the solar cell, depositing an electrically conductive adhesive over at least portion of the busbar an over at least a portion of the dielectric layer. Solar cell modules can be formed by interconnecting adjacent solar cells using an interconnection element.

Solar cell edge interconnects

Frontside metallization pastes for solar cell electrodes contain siloxanes. Metallization pastes containing siloxanes can be used to fabricate fine line, high aspect ratio, solar cell gridlines.

Siloxane-containing solar cell metallization pastes

A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved. Fabricating the support element in situ may avoid the use of adhesives to attach the lamina to a permanent support element. In some embodiments, this process flow allows the lamina to be annealed at high temperature, then to have an amorphous silicon layer formed on each face of the lamina following that anneal.

Method to form a device by constructing a support element on a thin semiconductor lamina

A novel method is described to create low-relief texture at a light-facing surface or a back surface of a photovoltaic cell. The peak-to-valley height and average peak-to-peak distance of the textured surface is less than about 1 microns, for example less than about 0.8 micron, for example about 0.5 microns or less. In a completed photovoltaic device, average reflectance for light having wavelength between 375 and 1010 nm at a light-facing surface with this texture is 6 percent or less, for example about 5 percent or less, in some instances about 3.5 percent. This texture is produced by forming an optional oxide layer at the surface, lightly buffing the surface, and etching with a crystallographically selective etch. Excellent texture may be produced by etching for as little as twelve minutes or less. Very little silicon, for example about 0.3 mg/cmor less, is lost at the textured surface during this etch.

Creation of low-relief texture for a photovoltaic cell

A cleave plane is defined in a semiconductor donor body by implanting ions into the wafer. A lamina is cleaved from the donor body, and a photovoltaic cell is formed which comprises the lamina. The implant may cause some damage to the crystal structure of the lamina. This damage can be repaired by annealing the lamina using microwave energy. If the lamina is bonded to a receiver element, the receiver element may be either transparent to microwaves, or may reflect microwaves, while the semiconductor material absorbs the microwaves. In this way the lamina can be annealed at high temperature while the receiver element remains cooler.

Microwave anneal of a thin lamina for use in a photovoltaic cell

The present invention generally relates to an edge deletion module positioned within an automated solar cell fabrication line. The edge deletion module may include a grinding wheel device for removing material from edge regions of a solar cell device and cleaning the edge regions of the solar cell device after removing the material. The edge deletion module may also include an abrasive element, a portion of which is ground as it is periodically, laterally advanced toward the grinding wheel device. A controller is provided for controlling the operation and function of various facets of the module.

Solar panel edge deletion module

A semiconductor assembly is described in which a support element is constructed on a surface of a semiconductor lamina. Following formation of the thin lamina, which may have a thickness about 50 microns or less, the support element is formed, for example by plating, or by application of a precursor and curing in situ, resulting in a support element which may be, for example, metal, ceramic, polymer, etc. This is in contrast to a rigid or semi-rigid pre-formed support element which is affixed to the lamina following its formation, or to a donor wafer from which the lamina is subsequently cleaved. Fabricating the support element in situ may avoid the use of adhesives to attach the lamina to a permanent support element; such adhesives may be unable to tolerate processing temperatures and conditions required to complete the device. In some embodiments, this process flow allows the lamina to be annealed at high temperature, then to have an amorphous silicon layer formed on each face of the lamina following that anneal. A device may be formed which comprises the lamina, such as a photovoltaic cell.

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Los Altos, CA, United States of America

Zhiyong Li